PD720101 5. RECOMMENDED SOLDERING CONDITIONS The
參數(shù)資料
型號: UPD720101F1-EA8-A
廠商: Renesas Electronics America
文件頁數(shù): 28/38頁
文件大?。?/td> 0K
描述: HOST CTLR USB 2.0 144-FBGA
標(biāo)準包裝: 100
控制器類型: USB 外設(shè)控制器
接口: PCI
電源電壓: 3 V ~ 3.6 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 144-LFBGA
供應(yīng)商設(shè)備封裝: 144-FBGA(12x12)
包裝: 托盤
其它名稱: 972-1002
Data Sheet S16265EJ5V0DS
32
PD720101
5.
RECOMMENDED SOLDERING CONDITIONS
The
PD720101 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
PD720101GJ-UEN: 144-pin plastic LQFP (Fine pitch) (20 × 20)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Three times or less
Exposure limit: 3 days
Note (after that, prebake at 125°C for 10 hours)
IR35-103-3
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
PD720101GJ-UEN-A: 144-pin plastic LQFP (Fine pitch) (20 × 20) Lead-free product
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 2
60°C, Time: 60 seconds max. (at 220°C or higher),
Count: Two times or less
Exposure limit: 3 days
Note (after that, prebake at 125°C for 10 hours)
IR60-103-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
PD720101F1-EA8: 144-pin plastic FBGA (12 × 12)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Three times or less
Exposure limit: 7 days
Note (after that, prebake at 125°C for 10 hours)
IR35-107-3
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
PD720101F1-EA8-A: 144-pin plastic FBGA (12 × 12) Lead-free product
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Two times or less
Exposure limit:
3 daysNote (after that, prebake at 125°C for 10 hours)
IR60-103-2
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
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