參數(shù)資料
型號(hào)： UPD70433R-12
廠商： NEC Corp.
元件分類： 16位微控制器
英文描述： V55PITM 16-BIT MICROPROCESSOR
中文描述： V55PITM 16位微處理器
文件頁數(shù)： 162/166頁
文件大?。?/td> 772K
代理商： UPD70433R-12
162
μ
PD70433
*
For the storage period after dry-pack decompression, storage conditions are max. 25
°
C, 65 % RH.
Note
Use of more than one soldering method should be avoided (except in the case of partial heating method).
(2)
μ
PD70433GJ-xx-3EB : 120-Pin Plastic QFP (Fine Pitch) (20
×
20 mm)
21. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document “
Semiconductor Device Mounting
Technology Manual” (C10535E)
.
For soldering methods and conditions other than those recommended, contact our sales personnel.
Table 21-1. Surface Mount Type Soldering Conditions
(1)
μ
PD70433GD-xx-5BB : 120-Pin Plastic QFP (28
×
28 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C
or above), Number of times: Within twice, Time limit: 7 days*
(thereafter 36 hours 125
°
C prebanking required)
Infrared reflow
IR35-367-2
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C
or above), Number of times: Within twice, Time limit: 7 days*
(thereafter 36 hours 125
°
C prebanking required)
VPS
VP15-367-2
Solder bath temperature: 260
°
C or less, Time: 10 sec. max.,
Number of times: Once, Time limit: 7 days* (thereafter 35 hours
125
°
C prebanking required), Preheating temperature: 120
°
C max.
(Package surface temperature)
Wave soldering
WS60-367-1
Partial heating
Pin temperature: 300
°
C or below, Duration: 3 sec. max. (per pin row)
–––
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C
or above), Number of times: Within twice
IR35-00-2
VPS
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C
or above), Number of times: Within twice
VP15-00-2
Partial heating
Pin temperature: 300
°
C or below, Duration: 3 sec. max. (per pin row)
–––
Note
Use of more than one soldering method should be avoided (except in the case of partial heating method).
Soldering Method
Soldering Conditions
Wave soldering
(lead part only)
Solder temperature: 260
°
C or less, Duration: 10 sec. max.
Partial heating
Pin temperature: 300
°
C or less, Duration: 3 sec. max. (per pin row)
Table 21-2. Insertion Type Soldering Conditions
μ
PD70433R-xx : 132-Pin Ceramic PGA
Note
Wave soldering is used on the lead part only, and care must be taken to prevent solder from coming into
direct contact with the body.
相關(guān)PDF資料
PDF描述
UPD70433R-16 V55PITM 16-BIT MICROPROCESSOR
UPD70433GD-12-5BB V55PITM 16-BIT MICROPROCESSOR
UPD70433GD-16-5BB V55PITM 16-BIT MICROPROCESSOR
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UPD70433GJ-16-3EB V55PITM 16-BIT MICROPROCESSOR
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