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參數(shù)資料
| 型號： | U0406FC33C |
| 廠商： | PROTEK DEVICES |
| 英文描述： | UNBUMPED FLIP CHIP ARRAY |
| 中文描述： | UNBUMPED倒裝芯片陣列 |
| 文件頁數(shù)： | 4/6頁 |
| 文件大?。?/td> | 115K |
| 代理商： | U0406FC33C |
4
www.protekdevices.com
05160.R3 3/05
U0406FC3.3C
thru
U0406FC36C
APPLICATION INFORMATION
Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
T
S
- Preheat
T
SMAX
T
SMIN
T
L
t 25°C to Peak
30-60 seconds
T
T
P
155°
140°
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50μm
±20μm
60 Seconds
270°C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-265°C
T
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
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| U0406FC36C | UNBUMPED FLIP CHIP ARRAY |
| U0408FC05C | UNBUMPED FLIP CHIP ARRAY |
| U0408FC08C | UNBUMPED FLIP CHIP ARRAY |
| U0408FC12C | UNBUMPED FLIP CHIP ARRAY |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| U0406FC36C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:UNBUMPED FLIP CHIP ARRAY |
| U0408FC05C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:UNBUMPED FLIP CHIP ARRAY |
| U0408FC08C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:UNBUMPED FLIP CHIP ARRAY |
| U0408FC12C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:UNBUMPED FLIP CHIP ARRAY |
| U0408FC15C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:UNBUMPED FLIP CHIP ARRAY |
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