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參數(shù)資料
| 型號： | TRA2532 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | Overvoltage Transient Suppressor |
| 中文描述： | UNIDIRECTIONAL, SILICON, TVS DIODE |
| 封裝： | MICRODE BUTTON, CASE 193, 2 PIN |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 61K |
| 代理商： | TRA2532 |
TRA2532
http://onsemi.com
7
Button holding fixtures for use during soldering may be
of various materials. Stainless steel has a longer use life
while black anodized aluminum is less expensive and will
limit heat reflection and enhance absorption. The assembly
volume will influence the choice of materials. Fixture
dimension tolerances for locating the button must allow for
expansion during soldering as well as allowing for button
clearance.
Heating Techniques
The following four heating methods have their
advantages and disadvantages depending on volume of
buttons to be soldered.
1.
Belt furnaces
readily handle large or small
volumes and are adaptable to establishment of
“on–line’’ assembly since a variable belt speed sets
the run rate. Individual furnace zone controls make
excellent temperature control possible.
2.
Flame Soldering
involves the directing of natural
gas flame jets at the base of a heatsink as the
heatsink is indexed to various loading–heating–
cooling–unloading positions. This is the most
economical labor method of soldering large
volumes. Flame soldering offers good temperature
control but requires sophisticated temperature
monitoring systems such as infrared.
3.
Ovens
are good for batch soldering and are
production limited. There are handling problems
because of slow cooling. Response time is load
dependent, being a function of the watt rating of the
oven and the mass of parts. Large ovens may not
give an acceptable temperature gradient. Capital
cost is low compared to belt furnaces and flame
soldering.
4.
Hot Plates
are good for soldering small quantities
of prototype devices. Temperature control is fair
with overshoot common because of the exposed
heating surface. Solder flow and positioning can be
corrected during soldering since the assembly is
exposed. Investment cost is very low.
Regardless of the heating method used, a soldering profile
giving the time–temperature relationship of the particular
method must be determined to assure proper soldering.
Profiling must be performed on a scheduled basis to
minimize
poor
soldering.
relationship will change depending on the heating method
used.
The
time–temperature
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TRA2532/D | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Overvoltage Transient Suppresor |
| TRA25B103MGS | 功能描述:多層陶瓷電容器MLCC - 含引線 .010UF 50.0V RoHS:否 制造商:AVX 電容:470 pF 容差:10 % 電壓額定值:3 kV 端接類型:Radial 工作溫度范圍: 溫度系數(shù)/代碼:X7R 引線間隔:5.08 mm 產(chǎn)品:Automotive MLCCs 引線類型: |
| TRA25D223KGS | 功能描述:多層陶瓷電容器MLCC - 含引線 .022UF 100V 10% HT RoHS:否 制造商:AVX 電容:470 pF 容差:10 % 電壓額定值:3 kV 端接類型:Radial 工作溫度范圍: 溫度系數(shù)/代碼:X7R 引線間隔:5.08 mm 產(chǎn)品:Automotive MLCCs 引線類型: |
| TRA291G/20-30 | 制造商:Cynergy3 功能描述:SPNO FormA Reedswitch,0.3A 100V 20-30AT |
| TRA294G 30-35 | 制造商:Cynergy3 功能描述:Bulk |
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