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參數(shù)資料
| 型號： | TR3005 |
| 廠商： | RF Monolithics, Inc. |
| 英文描述： | 403.50 MHz Hybrid Transceiver |
| 中文描述： | 403.50兆赫混合收發(fā)器 |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 196K |
| 代理商： | TR3005 |
Pin
Name
Description
1
GND1
GND1 is the RF ground pin. GND2 and GND3 should be connected to GND1 by short, low-inductance traces.
2
VCC1
VCC1 is the pos ive sup ply volt age pin for the trans mit er out put am pli ier and the re ceiver base-band cir cuitry.
VCC1 is usu ally con nected to the pos ive sup ply through a fer ite RF de coup ing bead, which is by passed by an
RF ca pac or on the
sup ply side
. See the
ASH Trans ceiver De signer’s Guide
for ad di ional in or ma ion.
3
AGCCAP
This pin con rols the AGC re set op er a ion. A ca pac or be ween this pin and ground sets the min mum time the
AGC will hold-in once it is en gaged. The hold-in time is set to avoid AGC chat er ng. For a given hold-in time t
AGH
,
the ca pac or value C
AGC
is:
C
AGC
= 19.1* t
AGH
, where t
AGH
is in μs and C
AGC
is in pF
A ±10% ce amic ca pac or should be used at this pin. The value of C
given above pro vides a hold-in time be
tween t
and 2.65* t
, de pend ng on op er at ng volt age, tem per a ure, etc. The hold-in time is cho sen to al ow
the AGC to ride through the lon gest run of zero bits that can oc cur in a re ceived data stream. The AGC hold-in
time can be greater than the peak de ec or de cay time, as dis cussed be ow. How ever, the AGC hold-in time
should not be set too long, or the re ceiver will be slow in re urn ng to full sen si iv ty once the AGC is en gaged by
noise or in er er ence. The use of AGC is op ional when us ng OOK mod u a ion with data pulses of at least 30 μs.
AGC op er a ion can be de eated by con nect ng this pin to Vcc. Ac ive or latched AGC op er a ion is re quired for
ASK mod u a ion and/or for data pulses of less than 30 μs. The AGC can be latched on once en gaged by con nect
ing a 150 K re sis or be ween this pin and ground, in stead of a ca pac or. AGC op er a ion de pends on a func ion ng
peak de ec or, as dis cussed be ow. The AGC ca pac or is dis charged in the re ceiver power-down (sleep) mode
and in the trans mit modes.
4
PKDET
This pin con rols the peak de ec or op er a ion. A ca pac or be ween this pin and ground sets the peak de ec or at
tack and de cay times, which have a fixed 1:1000 ra io. For most ap pli ca ions, these time con stants should be co
or di nated with the base-band time con stant. For a given base-band ca pac or C
BBO
,
the ca pac or value C
PKD
is:
C
PKD
= 0.33* C
BBO
, where C
BBO
and C
PKD
are in pF
A ±10% ce amic ca pac or should be used at this pin. This time con stant will vary be ween t
PKA
and 1.5* t
PKA
with
vari a ions in sup ply volt age, tem per a ure, etc. The ca pac or is driven from a 200 ohm “at ack” source, and de cays
through a 200 K load. The peak de ec or is used to drive the “dB-below-peak” data slicer and the AGC re ease
func ion. The AGC hold-in time can be ex ended be yond the peak de ec or de cay time with the AGC ca pac or, as
dis cussed above. Where low data rates and OOK mod u a ion are used, the “dB-below-peak” data slicer and the
AGC are op ional. In this case, the PKDET pin and the THLD2 pin can be left un con nected, and the AGC pin can
be con nected to Vcc to re duce the num ber of ex er nal com po nents needed. The peak de ec or ca pac or is dis
charged in the re ceiver power-down (sleep) mode and in the trans mit modes.
5
BBOUT
BBOUT is the re ceiver base-band out put pin. This pin drives the CMPIN pin through a cou pling ca pac or C
BBO
for
in er nal data slicer op er a ion. The time con stant t
BBC
for this con nec ion is:
t
BBC
= 0.064*C
BBO
, where t
BBC
is in μs and C
BBO
is in pF
A ±10% ce amic ca pac or should be used be ween BBOUT and CMPIN. The time con stant can vary be ween t
BBC
and 1.8*t
with vari a ions in sup ply volt age, tem per a ure, etc. The op i mum time con stant in a given cir cum
stance will de pend on the data rate, data run length, and other fac ors as dis cussed in the
ASH Trans ceiver De
. A com mon cri e ia is to set the time con stant for no more than a 20% volt age droop dur ng SP
MAX
.
For this case:
C
BBO
= 70*SP
MAX
, where SP
MAX
is the max mum sig nal pulse width in μs and C
BBO
is in pF
The out put from this pin can also be used to drive an ex er nal data re cov ery pro cess (DSP, etc.). The nom nal out -
put im ped ance of this pin is 1 K. When the re ceiver RF am pli i ers are op er at ng at a 50%-50% duty cy cle, the
BBOUT sig nal changes about 10 mV/dB, with a peak-to-peak sig nal level of up to 685 mV. For lower duty cy cles,
the mV/dB slope and peak-to-peak sig nal level are pro por ion ately less. The sig nal at BBOUT is rid ng on a
1.1 Vdc value that var es some what with sup ply volt age and tem per a ure, so it should be cou pled through a ca
pac or to an ex er nal load. A load im ped ance of 50 K to 500 K in par al el with no more than 10 pF is rec om
mended. When an ex er nal data re cov ery pro cess is used with AGC, BBOUT must be cou pled to the ex er nal
data re cov ery pro cess and CMPIN by sep a ate se ies cou pling ca pac ors. The AGC re set func ion is driven by
the sig nal ap plied to CMPIN. When the trans ceiver is in power-down (sleep) or in a trans mit mode, the out put im
ped ance of this pin be comes very high, pre serving the charge on the cou pling ca pac or.
6
CMPIN
This pin is the in put to the in er nal data slic ers. It is driven from BBOUT through a cou pling ca pac or. The in put
im ped ance of this pin is 70 K to 100 K.
7
RXDATA
RXDATA is the re ceiver data out put pin. This pin will drive a 10 pF, 500 K par al el load. The peak cur ent avail able
from this pin in creases with the re ceiver low-pass fil er cut off fre quency. In the power-down (sleep) or trans mit
modes, this pin be comes high im ped ance. If re quired, a 1000 K pull-up or pull-down re sis or can be used to es ab
lish a def nite logic state when this pin is high im ped ance. If a pull-up re sis or is used, the pos ive sup ply end
should be con nected to a volt age no greater than Vcc + 200 mV.
9
Pin De scrip ions
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