參數(shù)資料
型號(hào)： TPS78533
廠商： Texas Instruments, Inc.
元件分類： 基準(zhǔn)電壓源/電流源
英文描述： FAST-TRANSIENT RESPONSE 3-A LOW-DROPOUT VOLTAGE REGULATORS
中文描述： 快速瞬態(tài)響應(yīng)3 -低壓差電壓調(diào)節(jié)器
文件頁(yè)數(shù)： 15/24頁(yè)
文件大?。?/td> 450K
代理商： TPS78533
www.ti.com
1
10
0
10
20
PD
R
θ
SA
Heatsink Thermal Resistance
°
C/W
No Heatsink
T
A
= 55
°
C
Natural Convection
Air Flow = 150 LFM
Air Flow = 250 LFM
Air Flow = 500 LFM
TO-263 Power Dissipation
The TO-263 package provides an effective means of managing power dissipation in surface-mount applications.
The TO-263 package dimensions are provided in the
Mechanical Data
section at the end of the data sheet. The
addition of a copper plane directly underneath the TO-263 package enhances the thermal performance of the
package.
P
D
max
(3.3 – 2.5) V x 3 A
2.4 W
(7)
R
θ
JAmax
From Figure 25, R
Θ
JA
vs Copper Heatsink Area, the ground plane needs to be 2 cm
2
for the part to dissipate 2.4
W. The model operating environment used in the computer model to construct Figure 25 consisted of a standard
JEDEC High-K board (2S2P) with a 1 oz. internal copper plane and ground plane. The package is soldered to a
2 oz. copper pad. The pad is tied through thermal vias to the 1 oz. ground plane. Figure 26 shows the side view
of the operating environment used in the computer model.
(125 – 55)
°
C 2.4 W
29
°
C W
(8)
TPS75801, TPS75815
TPS75818, TPS75825
TPS75833
SLVS330D–JUNE 2001–REVISED MARCH 2004
THERMAL INFORMATION (continued)
Figure 24. Power Dissipation vs Heatsink Thermal Resistance
To illustrate, the TPS75825 in a TO-263 package was chosen. For this example, the average input voltage is 3.3
V, the average output voltage is 2.5 V, the average output current is 3 A, the ambient temperature 55
°
C, the air
flow is 150 LFM, and the operating environment is the same as documented below. Neglecting the quiescent
current, the maximum average power is:
Substituting T
J
max for T
J
into Equation 4 gives Equation 8:
15
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