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參數(shù)資料
| 型號(hào)： | TLC2202AMP |
| 廠商： | Texas Instruments, Inc. |
| 元件分類(lèi)： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS |
| 中文描述： | 高級(jí)LinCMOSE低噪聲高精度運(yùn)算放大器 |
| 文件頁(yè)數(shù)： | 6/62頁(yè) |
| 文件大?。?/td> | 969K |
| 代理商： | TLC2202AMP |
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TLC220x, TLC220xA, TLC220xB, TLC220xY
Advanced LinCMOS
LOW-NOISE PRECISION
OPERATIONAL AMPLIFIERS
SLOS175 – FEBRUARY 1997
6
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC2202Y chip formation
This chip, when properly assembled, displays characteristics similar to the TLC2202C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
1OUT
1IN+
1IN–
VDD+
(8)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN+
2IN–
2OUT
(4)
VDD–
100
80
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TLC2202BMJG | Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS |
| TLC2202MFK | Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS |
| TLC2202MP | Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS |
| TLC2202Y | Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS |
| TLC220X | Low Noise Precision Rail-To-Rail Output Operational Amplifier Family |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLC2202BCD | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS |
| TLC2202BCDR | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS |
| TLC2202BCP | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| TLC2202BID | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| TLC2202BIDR | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS |
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