參數(shù)資料
型號: TLC2201MD
廠商: Texas Instruments, Inc.
元件分類: 運動控制電子
英文描述: Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS
中文描述: 高級LinCMOSE低噪聲高精度運算放大器
文件頁數(shù): 5/62頁
文件大小: 969K
代理商: TLC2201MD
TLC220x, TLC220xA, TLC220xB, TLC220xY
Advanced LinCMOS
LOW-NOISE PRECISION
OPERATIONAL AMPLIFIERS
SLOS175 – FEBRUARY 1997
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC2201Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC2201C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding path. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACK SIDE OF CHIP.
TERMINAL NUMBERS ARE FOR THE
D, JG, AND P PACKAGES.
+
OUT
IN–
IN+
VDD+
(7)
(2)
(3)
(6)
(4)
VDD–
65
77
(2)
(3)
(4)
(6)
(7)
(8)
(1)
相關PDF資料
PDF描述
TLC2201MFK Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS
TLC2201MJG Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS
TLC2201MP Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS
TLC2201Y Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS
TLC2202AMD Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS
相關代理商/技術參數(shù)
參數(shù)描述
TLC2201MFK 制造商:TI 制造商全稱:Texas Instruments 功能描述:Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS
TLC2201MFKB 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Texas Instruments 功能描述:
TLC2201MJG 制造商:TI 制造商全稱:Texas Instruments 功能描述:Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS
TLC2201MJGB 制造商:Texas Instruments 功能描述:
TLC2201MLB 制造商:Rochester Electronics LLC 功能描述:- Bulk