參數(shù)資料
型號(hào)： THS6062D
廠商： Texas Instruments, Inc.
英文描述： LOW-NOISE ADSL DUAL DIFFERENTIAL RECEIVER
中文描述： 低噪聲寬帶雙差分接收機(jī)
文件頁數(shù)： 27/31頁
文件大小： 540K
代理商： THS6062D
THS6062
LOW-NOISE ADSL DUAL DIFFERENTIAL RECEIVER
SLOS228B – JANUARY 1999 – REVISED JUNE 1999
27
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD design considerations (continued)
DGN Package
θ
JA = 58.4
°
C/W
2 oz. Trace And Copper Pad
With Solder
DGN Package
θ
JA = 158
°
C/W
2 oz. Trace And
Copper Pad
Without Solder
SOIC Package
High-K Test PCB
θ
JA = 98
°
C/W
TJ = 150
°
C
SOIC Package
Low-K Test PCB
θ
JA = 167
°
C/W
2
1.5
1
0
–40
–20
0
20
40
M
2.5
3
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
3.5
60
80
100
0.5
TA – Free-Air Temperature –
°
C
NOTE A: Results are with no air flow and PCB size = 3”
×
3”
Figure 48. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package.This document can be
found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be
ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
The next thing that should be considered is the package constraints. The two sources of heat within an amplifier
are quiescent power and output power. The designer should never forget about the quiescent heat generated
within the device, especially a multiamplifier device. Because these devices have linear output stages (Class
A-B), most of the heat dissipation is at low output voltages with high output currents. Figure 49 and Figure 50
show this effect, along with the quiescent heat, with an ambient air temperature of 50
°
C. When using
V
CC
= 5 V or
±
5 V, there is generally not a heat problem, even with SOIC packages. But, when using
V
CC
=
±
15 V, the SOIC package is severely limited in the amount of heat it can dissipate. The other key factor
when looking at these graphs is how the devices are mounted on the PCB. The PowerPAD devices are
extremely useful for heat dissipation. But the device should always be soldered to a copper plane to fully use
the heat dissipation properties of the PowerPAD. The SOIC package, on the other hand, is highly dependent
on how it is mounted on the PCB. As more trace and copper area is placed around the device,
θ
JA
decreases
and the heat dissipation capability increases. The currents and voltages shown in these graphs are for the total
package. Because the THS6062 is a dual amplifier, the sum of the RMS output currents and voltages should
be used to choose the proper package.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
THS6062DGN 制造商:TI 制造商全稱:Texas Instruments 功能描述:LOW-NOISE ADSL DUAL DIFFERENTIAL RECEIVER
THS6062EVM 功能描述:其他開發(fā)工具 THS6062 Eval Mod RoHS:否 制造商:Parallax 產(chǎn)品:ELEV-8 Hex Upgrade Kits 類型:Robotics 工具用于評(píng)估:ELEV-8 Quadcopter 工作電源電壓:
THS6062ID 功能描述:緩沖器和線路驅(qū)動(dòng)器 High Speed RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
THS6062IDG4 功能描述:緩沖器和線路驅(qū)動(dòng)器 High Speed RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
THS6062IDGN 功能描述:緩沖器和線路驅(qū)動(dòng)器 High Speed RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
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