參數(shù)資料
型號(hào)： THS6043CD
廠商： Texas Instruments, Inc.
英文描述： 350 mA, 【12 V ADSL CPE LINE DRIVERS
中文描述： 350毫安，【12伏ADSL終端線路驅(qū)動(dòng)器
文件頁數(shù)： 25/33頁
文件大?。?/td> 509K
代理商： THS6043CD
THS6042, THS6043
350 mA,
±
12 V ADSL CPE LINE DRIVERS
SLOS264G
–
MARCH 2000
–
REVISED DECEMBER 2001
25
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
PCB design considerations (continued)
The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent
power and output power. The designer should never forget about the quiescent heat generated within the
device, especially multiamplifier devices. Because these devices have linear output stages (Class-AB), most
of the heat dissipation is at low output voltages with high output currents. Figure 45 and Figure 46 show this
effect, along with the quiescent heat, with an ambient air temperature of 50
°
C. Obviously, as the ambient
temperature increases, the limit lines shown will drop accordingly. The area under each respective limit line is
considered the safe operating area. Any condition above this line will exceed the amplifier
’
s limits and failure
may result. When using V
CC
=
±
6 V, there is generally not a heat problem, even with SOIC packages.
However, when using V
CC
=
±
12 V, the SOIC package is severely limited in the amount of heat it can dissipate.
The other key factor when looking at these graphs is how the devices are mounted on the PCB. The PowerPAD
devices are extremely useful for heat dissipation. But, the device should always be soldered to a copper plane
to fully use the heat dissipation properties of the PowerPAD. The standard SOIC package, on the other hand,
is highly dependent on how it is mounted on the PCB. As more trace and copper area is placed around the
device,
θ
JA
decreases and the heat dissipation capability increases. The currents and voltages shown in these
graphs are for the total package.
Figure 45
10
100
1000
0
1
2
3
4
5
6
Both Channels
TJ = 150
°
C
TA = 50
°
C
Maximum Output
Current Limit Line
VCC =
±
6 V
PWP
θ
JA = 37.5
°
C/W
DDA
θ
JA = 45.8
°
C/W
SO-14 Package
θ
°
C/W
JA = 67
SO-8 Package
θ
°
C/W
JA = 95
–
–
IO
MAXIMUM RMS OUTPUT CURRENT
vs
RMS OUTPUT VOLTAGE (DUE TO THERMAL LIMITS)
VO
–
RMS Output Voltage
–
V
Figure 46
10
100
1000
0
2
4
6
8
10
12
Both Channels
TJ = 150
°
C
TA = 50
°
C
Maximum Output
Current Limit Line
VCC =
±
12 V
PWP
θ
JA = 37.5
°
C/W
DDA
θ
JA = 45.8
°
C/W
SO-14 Package
θ
°
C/W
HigJA = 67
SO-8 Package
θ
°
C/W
HigJA = 95
Safe
Operating
Area
VO
–
RMS Output Voltage
–
V
MAXIMUM RMS OUTPUT CURRENT
vs
RMS OUTPUT VOLTAGE (DUE TO THERMAL LIMITS)
–
–
IO
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
THS6043CDG4 功能描述:高速運(yùn)算放大器 350-mA +/-12V ADSL CPE Ln Drv w/Shtdwn RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS6043CDR 功能描述:高速運(yùn)算放大器 350-mA +/-12V ADSL CPE Ln Drv w/Shtdwn RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS6043CDRG4 功能描述:高速運(yùn)算放大器 350-mA +/-12V ADSL CPE Ln Drv w/Shtdwn RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS6043CPWP 功能描述:高速運(yùn)算放大器 350-mA +/-12V ADSL CPE Ln Drv w/Shtdwn RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS6043CPWPG4 功能描述:高速運(yùn)算放大器 350-mA +/-12V ADSL CPE Ln Drv w/Shtdwn RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
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