- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383996 > THS4082CDGN (Texas Instruments, Inc.) 175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS PDF資料下載
參數(shù)資料
| 型號(hào)： | THS4082CDGN |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | 175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS |
| 中文描述： | 175 - MHz的低功耗高速放大器 |
| 文件頁數(shù)： | 18/24頁 |
| 文件大?。?/td> | 384K |
| 代理商： | THS4082CDGN |
THS4081, THS4082
175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS
SLOS274C – DECEMBER 1999 – REVISED MAY 2000
18
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD
design considerations (continued)
The actual thermal performance achieved with the THS408xDGN in its PowerPAD
package depends on the
application. In the example above, if the size of the internal ground plane is approximately 3 inches
×
3 inches,
then the expected thermal coefficient,
θ
JA
,
is
about 58.4 C/W. For comparison, the non-PowerPAD
version
of the THS408x IC (SOIC) is shown. For a given
θ
JA
, the maximum power dissipation is shown in Figure 46 and
is calculated by the following formula:
PD
TMAX–TA
JA
Where:
P
D
T
MAX
= Absolute maximum junction temperature (150
°
C)
T
A
= Free-ambient air temperature (
°
C)
θ
JA
=
θ
JC
+
θ
CA
θ
JC
= Thermal coefficient from junction to case
θ
CA
= Thermal coefficient from case to ambient air (
°
C/W)
= Maximum power dissipation of THS408x IC (watts)
DGN Package
θ
JA = 58.4
°
C/W
2 oz. Trace And Copper Pad
With Solder
DGN Package
θ
JA = 158
°
C/W
2 oz. Trace And
Copper Pad
Without Solder
SOIC Package
High-K Test PCB
θ
JA = 98
°
C/W
TJ = 150
°
C
SOIC Package
Low-K Test PCB
θ
JA = 167
°
C/W
2
1.5
1
0
–40
–20
0
20
40
M
2.5
3
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
3.5
60
80
100
0.5
TA – Free-Air Temperature –
°
C
NOTE A: Results are with no air flow and PCB size = 3”
×
3”
Figure 46. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package.This document can be
found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be
ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| THS4082D | 175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS |
| THS4082DGN | 175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS |
| THS4082EVM | 175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS |
| THS4081D | 175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS |
| THS4081DGN | 175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| THS4082CDGNR | 功能描述:高速運(yùn)算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4082CDGNRG4 | 功能描述:高速運(yùn)算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4082CDR | 功能描述:高速運(yùn)算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4082CDRG4 | 功能描述:高速運(yùn)算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4082D | 制造商:TI 制造商全稱:Texas Instruments 功能描述:175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。