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參數(shù)資料
| 型號： | TDA8003TS |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | IIC-bus SIM Card Interface(IIC總線SIM卡接口) |
| 中文描述： | IIC總線的SIM卡接口（IIC總線的SIM卡接口） |
| 文件頁數(shù)： | 14/24頁 |
| 文件大小： | 111K |
| 代理商： | TDA8003TS |
2000 Apr 20
21
Philips Semiconductors
Product specication
I2C-bus SIM card interface
TDA8003TS
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
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| TDSG3160 | 7 SEG NUMERIC DISPLAY |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8003TS/C1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus SIM card interface |
| TDA8003TS/C2 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus SIM card interface |
| TDA8004 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:IC card interface |
| TDA8004AT | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:IC card interface |
| TDA8004AT/C1,112 | 功能描述:輸入/輸出控制器接口集成電路 SMART CARD INTERFACE RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray |
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