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參數(shù)資料
| 型號： | TC1108-50VDB |
| 廠商： | Microchip Technology Inc. |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | 300mA CMOS LDO |
| 中文描述： | 300mA的CMOS低壓 |
| 文件頁數(shù)： | 4/12頁 |
| 文件大?。?/td> | 430K |
| 代理商： | TC1108-50VDB |
TC1108
DS21357B-page 4
2002 Microchip Technology Inc.
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
thermal
protection
circuitry
shuts
the
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(T
A
MAX
), the maximum allowable die temperature
(T
J
MAX
) and the thermal resistance from junction-to-air
(
θ
JA
EQUATION 4-2:
Table 4-1 shows various values of
θ
JA
for the TC1108
versus board copper area.
TABLE 4-1:
THERMAL RESISTANCE
GUIDELINES FOR TC1108
NOTE:
*Tab of device attached to topside copper
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
V
IN
MAX
V
OUT
MIN
I
LOAD
MAX
= 275mA
T
J
MAX
T
A
MAX
θ
JA
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
= 3.3V + 10%
= 2.7V – 0.5%
= 125°C
= 95°C
= 59°C/W
Actual power dissipation:
P
D
≈
(V
IN
MAX
– V
OUT
MIN
)I
LOAD
MAX
= [(3.3 x 1.1) – (2.7 x .995)]275 x 10
–3
= 260mW
Maximum allowable power dissipation:
In this example, the TC1108 dissipates a maximum of
260mW; below the allowable limit of 508mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
V
IN
, is found by sustituting the maximum allowable
power dissipation of 508mW into Equation 4-1, from
which V
IN
MAX
= 4.6V.
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
(
θ
JA
)
45°C/W
45°C/W
53°C/W
59°C/W
52°C/W
55°C/W
2500 sq mm
1000 sq mm
225 sq mm
100 sq mm
1000 sq mm
1000 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
1000 sq mm
0 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
1000 sq mm
1000 sq mm
Where:
P
D
≈
(V
IN
MAX
– V
OUT
MIN
)I
LOAD
MAX
V
IN
MAX
V
OUT
MIN
I
LOAD
MAX
= Worst case actual power dissipation
= Maximum voltage on V
IN
= Minimum regulator output voltage
= Maximum output (load) current
P
D
P
D
MAX
= (T
J
MAX
– T
A
MAX
)
θ
JA
Where all terms are previously defined.
P
D
MAX
= (T
J
MAX
– T
A
MAX
)
θ
JA
= (125 – 95)
59
= 508mW
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| TC1108-xxVDB | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:300mA CMOS LDO |
| TC110DM | 功能描述:電源管理IC開發(fā)工具 TC110 Demo Board RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V |
| TC110G03AF-0104 | 制造商:Toshiba America Electronic Components 功能描述:110G03AF-0104 |
| TC110G05AT | 制造商:Toshiba America Electronic Components 功能描述:110G05AT |
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