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參數(shù)資料
| 型號： | TB5T1DR |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C |
| 中文描述： | 電可擦除可編程邏輯器件 |
| 文件頁數(shù)： | 12/17頁 |
| 文件大小： | 437K |
| 代理商： | TB5T1DR |
www.ti.com
APPLICATION INFORMATION
Power Dissipation
The power dissipation rating, often listed as the
package dissipation rating, is a function of the ambi-
ent temperature, T
A
, and the airflow around the
device. This rating correlates with the device's maxi-
mum junction temperature, sometimes listed in the
absolute maximum ratings tables. The maximum
junction temperature accounts for the processes and
materials used to fabricate and package the device,
in addition to the desired life expectancy.
40
60
80
100
120
140
0
100
200
Air Flow LFM
300
400
500
D, LowK
DW, LowK
D, HighK
DW, HighK
T
V
Sn
I
Sn
(V
Ln
I
Ln
)
T
J
T
A
P
D
JA
T
J
T
A
P
D
JA(S)
JA(S)
JC
CA
JB
BA
JC
CA
JB
BA
TB5T1
SLLS589B–NOVEMBER 2003–REVISED MAY 2004
There are two common approaches to estimating the
internal die junction temperature, T
J
. In both of these
methods, the device internal power dissipation P
D
needs to be calculated This is done by totaling the
supply power(s) to arrive at the system power
dissispation:
Figure 17. Thermal Impedance vs Air Flow
and then subtracting the total power dissipation of the
external load(s):
The standardized
θ
JA
values may not accurately
represent the conditions under which the device is
used. This can be due to adjacent devices acting as
heat sources or heat sinks, to nonuniform airflow, or
to the system PCB having significantly different ther-
mal characteristics than the standardized test PCBs.
The second method of system thermal analysis is
more accurate. This calculation uses the power
dissipation and ambient temperature, along with two
device and two system-level parameters:
θ
JC
, the junction-to-case thermal resistance, in
degrees Celsius per watt
θ
JB
, the junction-to-board thermal resistance, in
degrees Celsius per watt
θ
CA
, the case-to-ambient thermal resistance, in
degrees Celsius per watt
θ
BA
, the board-to-ambient thermal resistance, in
degrees Celsius per watt.
The first T
J
calculation uses the power dissipation
and ambient temperature, along with one parameter:
θ
JA
, the junction-to-ambient thermal resistance, in
degrees Celsius per watt.
The product of P
and
θ
is the junction temperature
rise above the ambient temperature. Therefore:
Note that
θ
JA
is highly dependent on the PCB on
which the device is mounted and on the airflow over
the
device
and
PCB.
standardized test conditions for measuring
θ
JA
. Two
commonly used conditions are the low-K and the
high-K
boards,
covered
EIA/JESD51-7 respectively. Figure 17 shows the
low-K and high-K values of
θ
versus air flow for this
device and its package options.
JEDEC/EIA
has
defined
by
EIA/JESD51-3
and
In this analysis, there are two parallel paths, one
through the case (package) to the ambient, and
another through the device to the PCB to the ambi-
ent. The system-level junction-to-ambient thermal im-
pedance,
θ
, is the equivalent parallel impedance
of the two parallel paths:
where
12
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| TB5T1DRE4 | 功能描述:LVDS 接口集成電路 5V Dual Full-Duplex PECL Transceiver RoHS:否 制造商:Texas Instruments 激勵器數(shù)量:4 接收機(jī)數(shù)量:4 數(shù)據(jù)速率:155.5 Mbps 工作電源電壓:5 V 最大功率耗散:1025 mW 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-16 Narrow 封裝:Reel |
| TB5T1DW | 功能描述:LVDS 接口集成電路 5V Dual Full-Duplex PECL Transceiver RoHS:否 制造商:Texas Instruments 激勵器數(shù)量:4 接收機(jī)數(shù)量:4 數(shù)據(jù)速率:155.5 Mbps 工作電源電壓:5 V 最大功率耗散:1025 mW 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-16 Narrow 封裝:Reel |
| TB5T1DWE4 | 功能描述:LVDS 接口集成電路 5V Dual Full-Duplex PECL Transceiver RoHS:否 制造商:Texas Instruments 激勵器數(shù)量:4 接收機(jī)數(shù)量:4 數(shù)據(jù)速率:155.5 Mbps 工作電源電壓:5 V 最大功率耗散:1025 mW 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-16 Narrow 封裝:Reel |
| TB5T1DWR | 功能描述:LVDS 接口集成電路 5V Dual Full-Duplex PECL Transceiver RoHS:否 制造商:Texas Instruments 激勵器數(shù)量:4 接收機(jī)數(shù)量:4 數(shù)據(jù)速率:155.5 Mbps 工作電源電壓:5 V 最大功率耗散:1025 mW 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-16 Narrow 封裝:Reel |
| TB5T1DWRE4 | 功能描述:LVDS 接口集成電路 5V Dual Full-Duplex PECL Transceiver RoHS:否 制造商:Texas Instruments 激勵器數(shù)量:4 接收機(jī)數(shù)量:4 數(shù)據(jù)速率:155.5 Mbps 工作電源電壓:5 V 最大功率耗散:1025 mW 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-16 Narrow 封裝:Reel |
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