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參數(shù)資料
| 型號(hào)： | SSC-SB104 |
| 廠商： | Seoul Semicondutctor Inc. |
| 英文描述： | CHIP LED DEVICE |
| 中文描述： | 芯片發(fā)光器件 |
| 文件頁(yè)數(shù)： | 4/7頁(yè) |
| 文件大小： | 331K |
| 代理商： | SSC-SB104 |
5. Soldering Profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
-Preliminary heating to be at 150
℃
max. for 2 minutes max.
-Soldering heat to be at 240
℃
max. for 5 seconds max.
Temperature
rise: 5°C/sec.
-5°C/sec.
Cooling:
Pre-heating
Operation heating
60 to 120 sec.
5sec. max
120
150
240
°C
0
~
L
(2) Lead-Free Solder
-Preliminary heating to be at 150
℃
max. for 2 minutes max.
-Soldering heat to be at 260
℃
max. for 10 seconds max.
~
120
60 to 120 sec.
0
260
150
L
°C
Pre-heating
rise: 5°C/sec.
Temperature
Operation heating
-5°C/sec.
Cooling:
10 sec.
(3) Hand Soldering conditions
-Not more than 3 seconds @MAX280
℃
, under Soldering iron.
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 4/7 -
SSC-SB104
SSC-QP-0401-06(REV.0)
[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.
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