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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
LCCC
CDIP
CDIP
SOIC
Package
Drawing
FK
J
J
D
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
JM38510/36002B2A
JM38510/36002BEA
SN54LS348J
SN74LS348D
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
20
16
16
16
TBD
TBD
TBD
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CU NIPDAU
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Level-1-260C-UNLIM
40
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
25
Pb-Free
(RoHS)
SN74LS348DE4
ACTIVE
SOIC
D
16
40
CU NIPDAU
Level-1-260C-UNLIM
SN74LS348DR
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LS348DRE4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LS348N
ACTIVE
PDIP
N
16
CU NIPDAU
N / A for Pkg Type
SN74LS348N3
SN74LS348NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
Pb-Free
(RoHS)
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N / A for Pkg Type
25
SN74LS348NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS348NSRE4
ACTIVE
SO
NS
16
CU NIPDAU
Level-1-260C-UNLIM
SNJ54LS348FK
SNJ54LS348J
SNJ54LS348W
OBSOLETE
OBSOLETE
OBSOLETE
LCCC
CDIP
CFP
FK
J
W
20
16
20
TBD
TBD
TBD
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(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Addendum-Page 1