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參數(shù)資料
| 型號(hào)： | SN54AS240AFK |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS |
| 中文描述： | 八路緩沖器/ 3司機(jī)態(tài)輸出 |
| 文件頁(yè)數(shù)： | 3/17頁(yè) |
| 文件大?。?/td> | 537K |
| 代理商： | SN54AS240AFK |
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SN54ALS240A, SN54AS240A, SN74ALS240A, SN74AS240A
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SDAS214E
–
DECEMBER 1982
–
REVISED AUGUST 2002
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
logic diagram (positive logic)
1
2
4
6
8
19
11
13
15
17
3
5
7
9
12
14
16
18
1A1
1A2
1A3
1A4
1Y1
2A1
2A2
2A3
2A4
2Y1
1Y2
1Y3
1Y4
2Y2
2Y3
2Y4
1OE
2OE
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
CC
Input voltage, V
I
Voltage applied to a disabled 3-state output
Package thermal impedance,
θ
JA
(see Note 1): DB package
7 V
7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5 V
70
°
C/W
58
°
C/W
70
°
C/W
60
°
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package
N package
Storage temperature range, T
stg
Stresses beyond those listed under
“
absolute maximum ratings
”
may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under
“
recommended operating conditions
”
is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
–
65
°
C to 150
°
C
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