
751
Table 25.2
DC Characteristics (Conditions: V
CC
= 5.0 V
±
10%, AV
CC
= 5.0 V
±
10%,
AV
CC
= V
CC
±
10%, AV
ref
= 4.5 V to AV
CC
, V
SS
= AV
SS
= 0 V, Ta = –20 to +75°C)
(cont)
Item
Pin
Symbol Min
Typ Max
Unit
Measurement
Conditions
Output
high-level
voltage
All output pins
V
OH
V
CC
– 0.5 —
3.5
—
V
I
OH =
–200 μA
I
OH
= –1 mA
—
—
V
Output low- All output pins
level
voltage
V
OL
—
—
0.4
V
I
OL
= 1.6 mA
I
OL
= 15 mA
PE9, PE11–PE15
—
—
1.5
V
Input
capaci-
tance
RES
Cin
—
—
80
*
1
pF
Vin = 0 V, f = 1 MHz,
Ta = 25°C
NMI
—
—
50
pF
All other input
pins
—
—
20
pF
Current
consump-
tion
Ordinary
operation
I
CC
—
160 230
mA
f = 28 MHz
Sleep
—
140 200
mA
f = 28 MHz
Standby
—
0.01 5
μA
Ta
≤
50°C
Ta
>
50°C
—
—
20
μA
Analog
supply
current
AI
CC
AI
ref
—
5
10
1
*
2
mA
—
0.5
mA
QFP144 version only
RAM
standby
voltage
Notes: 1. When the A/D converter is not used (including during standby), do not release the AV
CC
,
AV
, and AV
(SH7041,SH7043,SH7045 only) pins. Connect the AV
CC
and AV
ref
(SH7041,SH7043,SH7045 only) pins to V
CC
and the AV
SS
pin to V
SS
.
2. The current consumption is measured when V
IH
min = V
CC
– 0.5 V, V
IL
max = 0.5 V, with
all output pins unloaded.
3. The ZTAT and mask versions as well as F-ZTAT and mask versions have the same
functions, and the electrical characteristics of both are within specification, but
characteristic-related performance values, operating margins, noise margins, noise
emission, etc., are different. Caution is therefore required in carrying out system design,
when switching between ZTAT and mask versions, and when switching between F-
ZTAT and mask versions.
4. When the SH7040 chip is used for high-speed operation, the package surface
temperature rises. Appropriate measures (such as heat dissipation) to ensure overall
system reliability and safety should therefore be investigated.
*
1 110pF for A mask
*
2 5 mA in the A mask version, except for F-ZTAT products.
V
RAM
2.0
—
—
V