參數(shù)資料
型號(hào): SB80L186EB8
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 16-BIT, 8 MHz, MICROPROCESSOR, PQFP80
封裝: SHRINK, QFP-80
文件頁(yè)數(shù): 15/59頁(yè)
文件大?。?/td> 664K
代理商: SB80L186EB8
80C186EB80C188EB 80L186EB80L188EB
PACKAGE THERMAL
SPECIFICATIONS
The 80C186EB80L186EB is specified for operation
when TC (the case temperature) is within the range
of b40 Cto a100 C (PLCC package) or b40 Cto
a
114 C (QFP package) TC may be measured in
any environment to determine whether the proces-
sor is within the specified operating range The case
temperature must be measured at the center of the
top surface
TA (the ambient temperature) can be calculated
from iCA (thermal resistance from the case to ambi-
ent) with the following equation
TA e TC b P iCA
Typical values for iCA at various airflows are given
in Table 10 P (the maximum power consumption
specified in watts) is calculated by using the maxi-
mum ICC as tabulated in the DC specifications and
VCC of 55V
Table 10 Thermal Resistance (iCA) at Various Airflows (in CWatt)
Airflow Linear ftmin (msec)
0
200
400
600
800
1000
(0) (101) (203) (304) (406) (507)
iCA (PLCC)
30
24
21
19
17
165
iCA (QFP)
58
47
43
40
38
36
iCA (SQFP)
70
TBD
22
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