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參數資料
| 型號： | S29JL032H90TAI223 |
| 廠商： | ADVANCED MICRO DEVICES INC |
| 元件分類： | PROM |
| 英文描述： | 2M X 16 FLASH 3V PROM, 90 ns, PDSO48 |
| 封裝： | MO-142DD, TSOP-48 |
| 文件頁數： | 6/66頁 |
| 文件大小： | 1691K |
| 代理商： | S29JL032H90TAI223 |
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S29JL032H
S29JL032H_00A11 March 10, 2005
Advan ce
In form ati o n
Word/Byte Configuration
The BYTE# pin controls whether the device data I/O pins operate in the byte or
word configuration. If the BYTE# pin is set at logic ‘1’, the device is in word con-
figuration, DQ15–DQ0 are active and controlled by CE# and OE#.
If the BYTE# pin is set at logic ‘0’, the device is in byte configuration, and only
data I/O pins DQ7–DQ0 are active and controlled by CE# and OE#. The data I/
O pins DQ14–DQ8 are tri-stated, and the DQ15 pin is used as an input for the
LSB (A-1) address function.
Requirements for Reading Array Data
To read array data from the outputs, the system must drive the CE# and OE#
pins to VIL. CE# is the power control and selects the device. OE# is the output
control and gates array data to the output pins. WE# should remain at VIH. The
BYTE# pin determines whether the device outputs array data in words or bytes.
The internal state machine is set for reading array data upon device power-up,
or after a hardware reset. This ensures that no spurious alteration of the memory
content occurs during the power transition. No command is necessary in this
mode to obtain array data. Standard microprocessor read cycles that assert valid
addresses on the device address inputs produce valid data on the device data
outputs. Each bank remains enabled for read access until the command register
contents are altered.
Refer to the AC Read-Only Operations table for timing specifications and to Figure
tive current specification for reading array data.
Writing Commands/Command Sequences
To write a command or command sequence (which includes programming data
to the device and erasing sectors of memory), the system must drive WE# and
CE# to VIL, and OE# to VIH.
For program operations, the BYTE# pin determines whether the device accepts
program data in bytes or words. Refer to “Word/Byte Configuration” for more
information.
The device features an Unlock Bypass mode to facilitate faster programming.
Once a bank enters the Unlock Bypass mode, only two write cycles are required
to program a word or byte, instead of four. The “Byte/Word Program Command
Sequence” section has details on programming data to the device using both
standard and Unlock Bypass command sequences.
An erase operation can erase one sector, multiple sectors, or the entire device.
“sector address” is the address bits required to uniquely select a sector. The
“Command Definitions” section has details on erasing a sector or the entire chip,
or suspending/resuming the erase operation.
The device address space is divided into four banks. A “bank address” is the ad-
dress bits required to uniquely select a bank.
ICC2 in the DC Characteristics table represents the active current specification for
the write mode. The AC Characteristics section contains timing specification ta-
bles and timing diagrams for write operations.
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| S29JL032H90TAI310 | 功能描述:閃存 3V 32Mb Float Gate top boot 2Banks 90s RoHS:否 制造商:ON Semiconductor 數據總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| S29JL032H90TAI311 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:32M BIT CMOS 3.0V FLASH MEMORY |
| S29JL032H90TAI312 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:32M BIT CMOS 3.0V FLASH MEMORY |
| S29JL032H90TAI313 | 功能描述:閃存 3V 32M SIMULTANEOUS READ/WRITE FLASH RoHS:否 制造商:ON Semiconductor 數據總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| S29JL032H90TAI320 | 功能描述:閃存 3V 32Mb Float Gate btm boot 2Banks 90s RoHS:否 制造商:ON Semiconductor 數據總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
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