參數(shù)資料
型號(hào): S29JL032H90TAI223
廠商: ADVANCED MICRO DEVICES INC
元件分類: PROM
英文描述: 2M X 16 FLASH 3V PROM, 90 ns, PDSO48
封裝: MO-142DD, TSOP-48
文件頁(yè)數(shù): 31/66頁(yè)
文件大?。?/td> 1691K
代理商: S29JL032H90TAI223
March 10, 2005 S29JL032H_00A11
S29JL032H
35
Ad vance
Info rmat i o n
Figure 4 illustrates the algorithm for the erase operation. Refer to the Erase and
Program Operations tables in the AC Characteristics section for parameters, and
Figure 19 section for timing diagrams.
Sector Erase Command Sequence
Sector erase is a six bus cycle operation. The sector erase command sequence is
initiated by writing two unlock cycles, followed by a set-up command. Two addi-
tional unlock cycles are written, and are then followed by the address of the
sector to be erased, and the sector erase command. Table 13 shows the address
and data requirements for the sector erase command sequence.
The device does not require the system to preprogram prior to erase. The Em-
bedded Erase algorithm automatically programs and verifies the entire sector for
an all zero data pattern prior to electrical erase. The system is not required to
provide any controls or timings during these operations.
After the command sequence is written, a sector erase time-out of 80 s occurs.
During the time-out period, additional sector addresses and sector erase com-
mands may be written. Loading the sector erase buffer may be done in any
sequence, and the number of sectors may be from one sector to all sectors. The
time between these additional cycles must be less than 80 s, otherwise erasure
may begin. Any sector erase address and command following the exceeded time-
out may or may not be accepted. It is recommended that processor interrupts be
disabled during this time to ensure all commands are accepted. The interrupts
can be re-enabled after the last Sector Erase command is written. Any com-
mand other than Sector Erase or Erase Suspend during the time-out
period resets that bank to the read mode. The system must rewrite the com-
mand sequence and any additional addresses and commands.
The system can monitor DQ3 to determine if the sector erase timer has timed out
(See the section on DQ3: Sector Erase Timer.). The time-out begins from the ris-
ing edge of the final WE# or CE# pulse (first rising edge) in the command
sequence.
When the Embedded Erase algorithm is complete, the bank returns to reading
array data and addresses are no longer latched. Note that while the Embedded
Erase operation is in progress, the system can read data from the non-erasing
bank. The system can determine the status of the erase operation by reading
DQ7, DQ6, DQ2, or RY/BY# in the erasing bank. Refer to the Write Operation Sta-
tus section for information on these status bits.
Once the sector erase operation has begun, only the Erase Suspend command is
valid. All other commands are ignored. However, note that a hardware reset im-
mediately terminates the erase operation. If that occurs, the sector erase
command sequence should be reinitiated once that bank has returned to reading
array data, to ensure data integrity. Note that the SecSi Sector, autoselect, and
CFI functions are unavailable when an erase operation is in progress.
Figure 4 illustrates the algorithm for the erase operation. Refer to the Erase and
Program Operations tables in the AC Characteristics section for parameters, and
Figure 19 section for timing diagrams.
相關(guān)PDF資料
PDF描述
S29WS064N0PBAW011 256/128/64 MEGABIT CMOS 1.8 VOLT ONLY SIMULTANEOUS READ/WRITE BURST MODE FLASH MEMORY
S29WS128N0LBFI111 256/128/64 MEGABIT CMOS 1.8 VOLT ONLY SIMULTANEOUS READ/WRITE BURST MODE FLASH MEMORY
S29WS128N0LBFI112 256/128/64 MEGABIT CMOS 1.8 VOLT ONLY SIMULTANEOUS READ/WRITE BURST MODE FLASH MEMORY
S29WS128N0LBFI113 256/128/64 MEGABIT CMOS 1.8 VOLT ONLY SIMULTANEOUS READ/WRITE BURST MODE FLASH MEMORY
S29WS128N0LBFW011 Test Clip; Current Rating:100A; Body Material:Steel; Features:Unmarked; Jaw Opening Max:1.625"; Overall Length:6" RoHS Compliant: NA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S29JL032H90TAI310 功能描述:閃存 3V 32Mb Float Gate top boot 2Banks 90s RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類型: 接口類型:SPI 訪問(wèn)時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
S29JL032H90TAI311 制造商:SPANSION 制造商全稱:SPANSION 功能描述:32M BIT CMOS 3.0V FLASH MEMORY
S29JL032H90TAI312 制造商:SPANSION 制造商全稱:SPANSION 功能描述:32M BIT CMOS 3.0V FLASH MEMORY
S29JL032H90TAI313 功能描述:閃存 3V 32M SIMULTANEOUS READ/WRITE FLASH RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類型: 接口類型:SPI 訪問(wèn)時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
S29JL032H90TAI320 功能描述:閃存 3V 32Mb Float Gate btm boot 2Banks 90s RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類型: 接口類型:SPI 訪問(wèn)時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel