參數資料
型號: S29GL032N90BFI32
廠商: SPANSION LLC
元件分類: PROM
英文描述: 2M X 16 FLASH 3V PROM, 90 ns, PBGA48
封裝: 8.15 X 6.15 MM, LEAD FREE, FBGA-48
文件頁數: 7/81頁
文件大小: 3095K
代理商: S29GL032N90BFI32
October 29, 2008 S29GL-N_01_12
S29GL-N MirrorBit Flash Family
15
Data
She e t
6.
Ordering Information–S29GL032N
S29GL032N Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
S29GL032N
90
T
F
I
01
0
PACKING TYPE
0=
Tray
2
=
7-inch Tape and Reel
3
=
13-inch Tape and Reel
MODEL NUMBER
01 =
x8/x16, VCC= VIO = 2.7 – 3.6 V, Uniform sector, WP#/ACC = VIL protects highest addressed sector
02 =
x8/x16, VCC = VIO = 2.7 – 3.6 V, Uniform sector, WP#/ACC = VIL protects lowest addressed sector
03 =
x8/x16, VCC = 2.7 – 3.6 V, Top boot sector, WP#/ACC = VIL protects top two addressed sectors
04 =
x8/x16, VCC = 2.7 – 3.6 V, Bottom boot sector, WP#/ACC = VIL protects bottom two addressed sectors
V1 =
x8/x16, VCC = 2.7 – 3.6 V, VIO = 1.65 - 3.6 V, Uniform sector, WP#/ACC = VIL protects highest addressed
sector
V2 =
x8/x16, VCC = 2.7 – 3.6 V, VIO = 1.65 - 3.6 V, Uniform sector, WP#/ACC = VIL protects lowest addressed sector
TEMPERATURE RANGE
I
=
Industrial (–40°C to +85°C)
PACKAGE MATERIAL SET
A
=
Standard (Note 4)
F
=
Pb-Free
PACKAGE TYPE
B
=
Fine-pitch Ball-Grid Array Package
D
=
Fortified Ball-Grid Array Package(LAE064), 9 mm x 9 mm
F
=
Fortified Ball-Grid Array Package (LAA064), 13 mm x 11 mm
T
=
Thin Small Outline Package (TSOP) Standard Pinout
SPEED OPTION
See Product Selector Guide and Valid Combinations (90 = 90 ns, 11 = 110 ns)
DEVICE NUMBER/DESCRIPTION
S29GL032N
32 Megabit Page-Mode Flash Memory
Manufactured using 110 nm MirrorBit
Process Technology, 3.0 Volt-only Read, Program, and Erase
Table 6.1 S29GL032N Ordering Options (Note 4)
S29GL032N Valid Combinations
Package Description
Device
Number
Speed
Option
Package, Material,
& Temperature Range
Model
Number
Packing
Type
S29GL032N
90
TFI
03, 04
0,2,3
TS048 (Note 2)
TSOP
90
01, 02
TS056 (Note 2)
11
V1, V2
90
BFI
03, 04
VBK048 (Note 3)
Fine-Pitch BGA
90
FFI
01, 02, 03, 04
LAA064 (Note 3)
Fortified BGA
11
V1, V2
90
DFI
01, 02, 03, 04
LAE064 (Note 3)
11
V1, V2
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in
Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator from ordering
part number.
3. BGA package marking omits leading S29 and packing type designator
from ordering part number.
4. Contact local sales for availability for Leaded lead-frame parts.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this
device. Consult your local sales office to confirm availability of specific valid
combinations and to check on newly released combinations.
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S29GL032N90DFI023 功能描述:IC FLASH 32MBIT 90NS 64BGA 制造商:cypress semiconductor corp 系列:GL-N 包裝:剪切帶(CT) 零件狀態(tài):在售 存儲器類型:非易失 存儲器格式:閃存 技術:FLASH - NOR 存儲容量:32Mb (4M x 8,2M x 16) 寫周期時間 - 字,頁:90ns 訪問時間:90ns 存儲器接口:并聯 電壓 - 電源:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C(TA) 安裝類型:表面貼裝 封裝/外殼:64-LBGA 供應商器件封裝:64 球加強型 BGA(9x9) 標準包裝:1
S29GL032N90FAI030 制造商:Spansion 功能描述:IC, FLASH - Trays
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S29GL032N90FFI010 功能描述:閃存 32Mb 3V 90ns Parallel NOR 閃存 RoHS:否 制造商:ON Semiconductor 數據總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel