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參數(shù)資料
| 型號(hào)： | S29GL01GP12FACR13 |
| 廠商： | SPANSION LLC |
| 元件分類： | PROM |
| 英文描述： | 1G X 1 FLASH 3V PROM, 120 ns, PBGA64 |
| 封裝： | 13 X 11 MM, 1 MM PITCH, FBGA-64 |
| 文件頁數(shù)： | 8/80頁 |
| 文件大小： | 2706K |
| 代理商： | S29GL01GP12FACR13 |
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16
S29GL-P MirrorBit Flash Family
S29GL-P_00_A12 November 20, 2009
Da ta
Sh e e t
4.4
TS056—56-Pin Standard Thin Small Outline Package (TSOP)
Figure 4.4 56-Pin Thin Small Outline Package (TSOP), 14 x 20 mm
NOTES:
1
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)
2
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
3
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
4
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
MOLD PROTUSION IS 0.15 mm PER SIDE.
5
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE
DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b
DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN
PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.
6
THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10 mm AND 0.25 mm FROM THE LEAD TIP.
7
LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
SEATING PLANE.
8
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
3160\38.10A
MO-142 (B) EC
TS 56
NOM.
---
1.00
1.20
0.15
1.05
MAX.
---
MIN.
0.95
0.20
0.23
0.17
0.22
0.27
0.17
---
0.16
0.10
---
0.21
0.10
20.00
20.20
19.80
14.00
14.10
13.90
0.60
0.70
0.50
-8
0
---
0.20
0.08
56
18.40
18.50
18.30
0.05
0.50 BASIC
E
R
b1
JEDEC
PACKAGE
SYMBOL
A
A2
A1
D1
D
c1
c
b
e
L
N
O
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