
10
PAD LAYOUT
A-108
EPSON
S1C33T01 PRODUCT PART
No.
Pad name
X
Y
No.
Pad name
X
Y
101 A16
2,373
2,288
151 N.C
-1,890
2,288
102 N.C
2,247
2,288
152 P74
-1,974
2,288
103 A17
2,142
2,288
153 N.C
-2,058
2,288
104 N.C
2,058
2,288
154 P73/SDA1
-2,142
2,288
105 A18
1,974
2,288
155 N.C
-2,247
2,288
106 N.C
1,890
2,288
156 P72/SCL1
-2,373
2,288
107 A19
1,806
2,288
157 P71/SDA0
-2,855
1,806
108 N.C
1,722
2,288
158 P70/SCL0
-2,855
1,722
109 A20
1,638
2,288
159 #NMI
-2,855
1,638
110 N.C
1,554
2,288
160 PLLS1
-2,855
1,154
111 A21
1,470
2,288
161 PLLS0
-2,855
1,470
112 N.C
1,386
2,288
162 #RESET
-2,855
1,386
113 A22
1,302
2,288
163 PLLC
-2,855
1,302
114 A23
1,218
2,288
164 VSS
-2,855
1,218
115 BVDDE
1,134
2,288
165 P67
-2,855
1,134
116 D15
1,050
2,288
166 P66
-2,855
1,050
117 D14
966
2,288
167 P65
-2,855
966
118 D13
882
2,288
168 P64
-2,855
882
119 D12
798
2,288
169 P63
-2,855
798
120 D11
714
2,288
170 P62
-2,855
714
121 D10
630
2,288
171 VDDE
-2,855
630
122 VSS
546
2,288
172 P61
-2,855
546
123 D9
462
2,288
173 P60
-2,855
462
124 D8
378
2,288
174 P57
-2,855
378
125 D7
294
2,288
175 P56
-2,855
294
126 D6
210
2,288
176 P55
-2,855
210
127 D5
126
2,288
177 P54
-2,855
126
128 VDD
42
2,288
178 VSS
-2,855
42
129 D4
-42
2,288
179 OSC4
-2,855
-42
130 D3
-126
2,288
180 OSC3
-2,855
-126
131 D2
-210
2,288
181 VDD
-2,855
-210
132 D1
-294
2,288
182 P53
-2,855
-294
133 D0
-378
2,288
183 P52
-2,855
-378
134 BVDDE
-462
2,288
184 P51/T8UF5
-2,855
-462
135 P87/TM9
-546
2,288
185 P50/T8UF4
-2,855
-546
136 P86/TM8
-630
2,288
186 P16/EXCL5/#DMAEND1
-2,855
-630
137 P85/TM7
-714
2,288
187 P15/EXCL4/#DMAEND0
-2,855
-714
138 VDDE
-798
2,288
188 VSS
-2,855
-798
139 P84/TM6
-882
2,288
189 P14/FOSC1/DCLK
-2,855
-882
140 P83/EXCL9
-966
2,288
190 P13/EXCL3/T8UF3/DPCO
-2,855
-966
141 P82/EXCL8
-1,050
2,288
191 P12/EXCL2/T8UF2/DST2
-2,855
-1,050
142 VSS
-1,134
2,288
192 P11/EXCL1/T8UF1/DST1
-2,855
-1,134
143 P81/EXCL7
-1,218
2,288
193 P10/EXCL0/T8UF0/DST0
-2,855
-1,218
144 P80/EXCL6
-1,302
2,288
194 DSIO
-2,855
-1,302
145 N.C
-1,386
2,288
195 P27/TM5
-2,855
-1,386
146 P77
-1,470
2,288
196 P26/TM4
-2,855
-1,470
147 N.C
-1,554
2,288
197 P25/TM3
-2,855
-1,554
148 P76
-1,638
2,288
198 P24/TM2
-2,855
-1,638
149 N.C
-1,722
2,288
199 P23/TM1
-2,855
-1,722
150 P75
-1,806
2,288
200 P22/TM0
-2,855
-1,806
Note: The S1C33T01 is constructed with 0.35
m process technology. Since the pad pitch is too small, it is
impossible to use all pads when mounting the chip (die form) on the board. When mounting the
chip, use the pads other than "N.C."