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參數(shù)資料
| 型號(hào)： | S10200-02 |
| 廠商： | Hamamatsu Photonics |
| 英文描述： | Diode; Attenuator; VR (V): 30; IF (mA): 100; Pd (mW): 150; rf (ohm) max: 2.5; Condition IF at rf (mA): 10; Condition f at rf (MHz): 100; VF (V) max: 1; Condition IF at VF (mA): 10; C (pF) max: 0.37; Condition VR at C (V): 1; Condition f at C (MHz): 1; Package: SFP |
| 中文描述： | 回到清淡TDI發(fā)動(dòng)機(jī)，防治荒漠化工作的后臺(tái)薄TDI的模式在防治荒漠化公約提供高靈敏度。 |
| 文件頁(yè)數(shù)： | 1/11頁(yè) |
| 文件大?。?/td> | 232K |
| 代理商： | S10200-02 |
TDI-CCD captures clear and bright images even under low-light-level conditions. During TDI mode, the CCD captures an image of a moving
object while transferring integrated signal charges synchronously with the object movement. This operation mode dramatically boosts sensitivity
to high levels even when capturing fast moving objects. Our new TDI-CCD uses the back-thinned structure to achieve even higher quantum
efficiency over a wide spectral range from UV to near IR region (200 to 1100 nm).
Features
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TDI mode gives high sensitivity
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High-speed, continuous image acquisition
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Back-thinned structure ensures high sensitivity from UV to
near IR
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Multiple ports for high-speed line rate
Applications
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Sequential imaging of high-speed moving samples
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Inspection tasks on electronic parts production line
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Semiconductor inspection
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Flow cytometery
I M A G E S E N S O R
Back-thinned TDI-CCD
S10200-02, S10201-04, S10202-08, S10202-16
Operating the back-thinned CCD in TDI mode delivers high sensitivity.
PRELIMINARY DATA
Jan. 2007
1
I
Selection guide
Type No.
Pixel size
(μm)
Number of
total pixels
(H) × (V)
1040 × 128
2080 × 128
4160 × 128
4224 × 128
Number of
active pixels
(H) × (V)
1024 × 128
2048 × 128
4096 × 128
4096 × 128
Number
of ports
Pixel rate
(MHz/port)
Line rate
(kHz)
Vertical
transfer
S10200-02
S10201-04
S10202-08
S10202-16
2
4
8
16
50
12 × 12
30
100
Bidirectional
I
Specifications
Parameter
Specification
128
FW × 100 (Min.)
3 phases
2 phases
TDI stage
Anti-blooming
Vertical clock
Horizontal clock
Output circuit
Package
Window
Two-stage MOSFET source follower
Ceramic DIP
Quarts glass
G
Schematic diagram showing integrated exposure by
TDI mode
Time1
Time2
Time3
·
·
·
·
·
LAST STAGE M
C
·
O
C
KMPDC0139EA
v = f
×
d
v: Object moving speed, Charge transfer speed, f: Vertical transfer frequency, d: Pixel size
TDI (Time Delay Integration) mode
In FFT-CCD, signal charges in each line are vertically transferred during charge readout. TDI mode synchronizes this vertical
transfer timing with the movement of the object, so that signal charges are integrated a number of times equal to the number
of vertical stages of the CCD pixels.
In the TDI mode, the signal charges must be transferred in the same direction at the same speed as those of the object to be
imaged. These speeds are expressed by the following equation:
In the right figure, when the first stage charges are transferred
to the second stage, an additional charges are produced in the
second stage by photoelectric conversion and accumulated.
When this operation is continuously repeated until reaching
the last stage M (the number of vertical stages), signal charges
which are M times greater than the initial charges are accumu-
lated. Since the signal charges on each line are output from
the CCD horizontal shift register, a two-dimensional image
can be continuously acquired. In this way the TDI mode
achieves sensitivity which is M times higher than linear image
sensors (S/N is improved times). The TDI mode also
improves sensitivity variations compared to frame mode op-
eration.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S10201-04 | Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. |
| S10202-08 | Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. |
| S10202-16 | Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. |
| S10317 | Photo IC for laser beam synchronous detection Low voltage operation (3.3 V) |
| S10317-01 | Photo IC for laser beam synchronous detection Low voltage operation (3.3 V) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S10200-4 | 制造商:TOPY 功能描述: |
| S10200-PC | 制造商:TOPY 功能描述: |
| S10201-04 | 制造商:HAMAMATSU 制造商全稱(chēng):Hamamatsu Corporation 功能描述:Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. |
| S10202-08 | 制造商:HAMAMATSU 制造商全稱(chēng):Hamamatsu Corporation 功能描述:Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. |
| S10202-16 | 制造商:HAMAMATSU 制造商全稱(chēng):Hamamatsu Corporation 功能描述:Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. |
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