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參數(shù)資料
| 型號： | RJ80530VY700256 |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁數(shù)： | 59/89頁 |
| 文件大?。?/td> | 1672K |
| 代理商： | RJ80530VY700256 |
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Mobile Intel
Pentium
III Processor-M Datasheet
298340-002
Datasheet
59
5.2
Surface Mount Micro-FCBGA Package
The Mobile Intel Pentium
III
Processor-M will also be available in a surface mount, 479-ball Micro-
FCBGA package. The Low Voltage and Ultra Low Voltage processors will be available only in this
package. Mechanical specifications are shown in Table 37. Figure 25 through Figure 27 illustrate
different views of the package.
The Micro-FCBGA package may have capacitors placed in the area surrounding the die. Since the
die-side capacitors are electrically conductive, and only slightly shorter than the die height, care should
be taken to avoid contacting the capacitors with electrically conductive materials. Doing so may short
the capacitors, and possibly damage the device or render it inactive. The use of an insulating material
between the capacitors and any thermal solution should be considered to prevent capacitor shorting.
Table 37. Micro-FCBGA Package Mechanical Specifications
Symbol
Parameter
Min
Max
Unit
A
Overall height, as delivered (1)
2.27
2.77
mm
A2
Die height
0.854
mm
b
Ball diameter
0.78
mm
D
Package substrate length
34.9
35.1
mm
E
Package substrate width
34.9
35.1
mm
D1
Die length
11.18
mm
E1
Die width
7.19
mm
e
Ball pitch
1.27
mm
N
Ball count
479
each
K
Keep-out outline from edge of package
5
mm
K1
Keep-out outline at corner of package
7
mm
K2
Capacitor keep-out height
-
0.7
mm
S
Package edge to first ball center
1.625
mm
--
Solder ball coplanarity
0.20
mm
Pdie
Allowable pressure on the die for thermal solution
-
689
kPa
W
NOTES:
1.
All dimensions are subject to change.
2.
Overall height as delivered. Values were based on design specifications and tolerances. Final height after
surface mount depends on OEM motherboard design and SMT process.
Package weight
4.5
g
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