參數(shù)資料
型號(hào): RF5187
廠商: RF MICRO DEVICES INC
元件分類(lèi): 衰減器
英文描述: LOW POWER LINEAR AMPLIFIER
中文描述: 800 MHz - 2500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封裝: ROHS COMPLIANT, PLASTIC, SOIC-8
文件頁(yè)數(shù): 3/6頁(yè)
文件大?。?/td> 50K
代理商: RF5187
Preliminary
2-75
RF5187
Rev A1 011016
2
P
Pin
1
Function
RF IN
Description
RF input. This input is DC-coupled, so an external blocking capacitor is
required if this pin is connected to a DC path. An optimum match to
50
is obtained by providing an external series capacitor of 2.4pF and
then a shunt capacitor of 2.4pF. Those values are typical for 2140MHz;
other values may be required for other frequencies.
Same as pin 1.
Interface Schematic
2
3
RF IN
PC
Power control pin. For obtaining maximum performance, the voltage on
this pin can be used to set correct bias level. In a typical application this
is implemented by a feedback loop. The feedback can be based on the
actual supply current of the device (i.e. maintaining a fixed current
level), or it can be based on the RF output power level to maintain a
fixed RF power level (Automatic Level Control loop). A voltage of 0.5V
or lower brings the part into power down state.
Power supply pin for the bias circuits. External low frequency bypass
capacitors should be connected if no other low frequency decoupling is
nearby.
RF output and bias for the output stage. The power supply for the out-
put transistor needs to be supplied to this pin. This can be done
through a quarter-wavelength microstrip line that is RF-grounded at the
other end, or through an RF inductor that supports the required DC cur-
rents. Optimum load impedance is achieved by providing a shunt
capacitor of 1.8pF and a series capacitor of 3.3pF. Those values are
typical for 2140MHz; other values may be required for other frequen-
cies. Since there are several output pins available (which are internally
connected), one pin can be used for connecting the bias, another for
connecting a (third) harmonic trap filter, and the other pins for the RF
output.
Same as pin 5.
4
VCC
5
RF OUT
6
7
8
RF OUT
RF OUT
RF OUT
GND
Same as pin 5.
Same as pin 5.
Pkg
Base
Ground connection. The backside of the package should be connected
to the ground plane through a short path (i.e., vias under the device
may be required).
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