參數(shù)資料
型號(hào): RF1K49092
廠商: INTERSIL CORP
元件分類: JFETs
英文描述: Logic Level Complementary power MOSFET(邏輯電平可補(bǔ)償功率MOS場(chǎng)效應(yīng)管)
中文描述: 3.5 A, 12 V, 0.05 ohm, 2 CHANNEL, N AND P-CHANNEL, Si, POWER, MOSFET, MS-012AA
文件頁(yè)數(shù): 11/13頁(yè)
文件大?。?/td> 248K
代理商: RF1K49092
9-13
Soldering Precautions
1. The soldering process creates a considerable thermal
stress on any semiconductor component. The melting
temperature of solder is higher than the maximum rated
temperature of the device. The amount of time the device
is heated to a high temperature should be minimized to
assure device reliability. Therefore, the following precau-
tions should always be observed in order to minimize the
thermal stress to which the devices are subjected.
2. Always preheat the device.
3. Thedeltatemperaturebetweenthepreheatandsoldering
should always be less than 100
o
C. Failure to preheat the
device can result in excessive thermal stress which can
damage the device.
4. Themaximumtemperaturegradientshouldbelessthan5
o
C
per second when changing from preheating to soldering.
5. The peak temperature in the soldering process should be
at least 30
o
C higher than the melting point of the solder
chosen.
6. The maximum soldering temperature and time must not
exceed 260
o
C for 10 seconds on the leads and case of
the device.
7. After soldering is complete, the device should be allowed
to cool naturally for at least three minutes, as forced cool-
ing will increase the temperature gradient and may result
in latent failure due to mechanical stress.
8. During cooling, mechanical stress or shock should be
avoided.
RF1K49092
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