參數(shù)資料
型號: RF1K49086
廠商: INTERSIL CORP
元件分類: JFETs
英文描述: Dual N-Channel power MOSFET(雙路N溝道功率MOS場效應管)
中文描述: 3.5 A, 30 V, 0.132 ohm, 2 CHANNEL, N-CHANNEL, Si, POWER, MOSFET, MS-012AA
文件頁數(shù): 6/7頁
文件大?。?/td> 178K
代理商: RF1K49086
6
Soldering Precautions
The soldering process creates a considerable thermal stress
on any semiconductor component. The melting temperature
of solder is higher than the maximum rated temperature of
the device. The amount of time the device is heated to a high
temperature should be minimized to assure device reliability.
Therefore, the following precautions should always be
observed in order to minimize the thermal stress to which
the devices are subjected.
1. Always preheat the device.
2. Thedeltatemperaturebetweenthepreheatandsoldering
should always be less than 100
o
C. Failure to preheat the
device can result in excessive thermal stress which can
damage the device.
3. The maximum temperature gradient should be less than
5
o
C per second when changing from preheating to
soldering.
4. The peak temperature in the soldering process should be
at least 30
o
C higher than the melting point of the solder
chosen.
5. The maximum soldering temperature and time must not
exceed 260
o
C for 10 seconds on the leads and case of
the device.
6. After soldering is complete, the device should be allowed
to cool naturally for at least three minutes, as forced cool-
ing will increase the temperature gradient and may result
in latent failure due to mechanical stress.
7. During cooling, mechanical stress or shock should be
avoided.
FIGURE 17. RESISTIVE SWITCHING TEST CIRCUIT
FIGURE 18. RESISTIVE SWITCHING WAVEFORMS
FIGURE 19. GATE CHARGE TEST CIRCUIT
FIGURE 20. GATE CHARGE WAVEFORM
Test Circuits and Waveforms
(Continued)
V
GS
R
L
R
G
DUT
+
-
V
DD
t
ON
t
d(ON)
t
r
90%
10%
V
DS
90%
10%
t
f
t
d(OFF)
t
OFF
90%
50%
50%
10%
PULSE WIDTH
V
GS
0
0
R
L
V
GS
+
-
V
DS
V
DD
DUT
I
g(REF)
V
DD
Q
g(TH)
V
GS
= 2V
Q
g(10)
V
GS
= 10V
Q
g(TOT)
V
GS
= 20V
V
DS
V
GS
I
g(REF)
0
0
RF1K49086
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