參數(shù)資料
型號(hào)： PC755CMGSU350LE
廠商： ATMEL CORP
元件分類： 微控制器/微處理器
英文描述： PowerPC 755/745 RISC Microprocessor
中文描述： 32-BIT, 350 MHz, RISC PROCESSOR, CBGA360
封裝： SOLDER COLUMN INTERPOSER, CERAMIC, BGA-360
文件頁數(shù)： 16/50頁
文件大小： 1064K
代理商： PC755CMGSU350LE
16
PC755/745
2138D–HIREL–06/03
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not
guaranteed.
2. Revisions prior to Rev. 2.8 (Rev. E) offered different I/O voltage support.
3. 2.0V nominal.
4. 2.5V nominal.
5. 3.3V nominal.
Thermal Characteristics
Package Characteristics
Table 6 provides the package thermal characteristics for the PC755.
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) tempera-
ture, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
Table 5.
Recommended Operating Conditions
(1)
Recommended Value
Unit
300 MHz, 350 MHz
400 MHz
Characteristic
Symbol
Min
Max
Min
Max
Core supply voltage
(3)
V
DD
1.80
2.10
1.90
2.10
V
PLL supply voltage
(3)
AV
DD
1.80
2.10
1.90
2.10
V
L2 DLL supply voltage
(3)
L2AV
DD
1.80
2.10
1.90
2.10
V
Processor bus supply voltage
(2)(4)(5)
BVSEL = 1
OV
DD
2.375
2.625
2.375
2.625
V
3.135
3.465
3.135
3.465
V
L2 bus supply voltage
(2)(4)(5)
L2VSEL = 1
L2OV
DD
2.375
2.625
2.375
2.625
V
3.135
3.465
3.135
3.465
V
Input voltage
Processor bus
V
in
GND
OV
DD
GND
OV
DD
V
L2 Bus
V
in
GND
L2OV
DD
GND
L2OV
DD
V
JTAG Signals
V
in
GND
OV
DD
GND
OV
DD
V
Die-junction temperature
Military temperature range
T
j
-55
125
-55
125
°
C
Industrial temperature
T
j
-40
110
-40
110
°
C
Table 6.
Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
°
C/W
°
C/W
PC755
CBGA
PC755
PBGA
PC745
PBGA
Junction-to-ambient thermal resistance, natural convection
(1)(2)
R
θ
JA
R
θ
JMA
24
31
34
Junction-to-ambient thermal resistance, natural convection, four-layer
(2s2p) board
(1)(3)
17
25
26
Junction-to-ambient thermal resistance, 200 ft./min. airflow, single-layer
(1s) board
(1)(3)
R
θ
JMA
18
25
27
°
C/W
Junction-to-ambient thermal resistance, 200 ft./min. airflow, four-layer
(2s2p) board
(1)(3)
R
θ
JMA
14
21
22
°
C/W
Junction-to-board thermal resistance
(4)
R
θ
JB
R
θ
JC
8
17
17
°
C/W
°
C/W
Junction-to-case thermal resistance
(5)
< 0.1
< 0.1
< 0.1
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