- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄6168 > OPA567AIRHGT (Texas Instruments)IC OPAMP GP R-R 1.2MHZ 12VQFN PDF資料下載
參數(shù)資料
| 型號(hào)： | OPA567AIRHGT |
| 廠商： | Texas Instruments |
| 文件頁數(shù)： | 9/26頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC OPAMP GP R-R 1.2MHZ 12VQFN |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 放大器類型： | 通用 |
| 電路數(shù)： | 1 |
| 輸出類型： | 滿擺幅 |
| 轉(zhuǎn)換速率： | 1.2 V/µs |
| 增益帶寬積： | 1.2MHz |
| 電流 - 輸入偏壓： | 1pA |
| 電壓 - 輸入偏移： | 500µV |
| 電流 - 電源： | 9mA |
| 電流 - 輸出 / 通道： | 2.4A |
| 電壓 - 電源，單路/雙路(±)： | 2.5 V ~ 5.5 V，±1.25 V ~ 2.75 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 12-VQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 12-VQFN-EP（5x5） |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 產(chǎn)品目錄頁面： | 854 (CN2011-ZH PDF) |
| 其它名稱： | 296-18697-6 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁當(dāng)前第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁
OPA567
SBOS287A
17
www.ti.com
FIGURE 9. Junction-to-Ambient Thermal Resistance with
Various Heatsinking Efforts.
FIGURE 10. Maximum Power Dissipation vs Temperature.
FIGURE 11. Thermal Resistance vs Number of Thermal Vias.
FIGURE 12. Feedback Capacitor for Use with Higher Imped-
ance Networks.
The Maximum Power Dissipation vs Temperature for the
heatsinking methods referenced in Figure 9 is shown in
Figure 10.
FEEDBACK CAPACITOR IMPROVES RESPONSE
For optimum settling time and stability with higher impedance
feedback networks (RF > 50k), it may be necessary to add
a feedback capacitor across the feedback resistor, RF, as
shown in Figure 12. This capacitor compensates for the zero
created by the feedback network impedance and the input
capacitance of the OPA567 (and any parasitic layout capaci-
tance). The effect becomes more significant with higher
impedance networks.
The size of the capacitor needed is estimated using the
equation:
RIN CIN = RF CF
where CIN is the sum of the input capacitance of the OPA567
plus the parasitic layout capacitance.
To appropriately determine required heatsink area, required
power dissipation should be calculated and the relationship
between power dissipation and thermal resistance should be
considered to minimize shutdown conditions and allow for
proper long-term operation (junction temperature of 125
°C).
Once the heatsink area has been selected, worst-case load
conditions should be tested to ensure proper thermal protec-
tion.
For applications with limited board size, refer to Figure 11 for
the approximate thermal resistance relative to the number of
thermal vias. The QFN-12 package is well suited for continu-
ous power levels, as shown in Figure 10. Higher power levels
may be achieved in applications with a low on/off duty cycle.
OPA567
V+
V–
V
OUT
V
IN
R
IN
8
1, 12
2, 3
4, 5
9
R
IN CIN = RF CF
R
F
C
L
C
IN
C
IN
C
F
Where C
IN is equal to the OPA567 input
capacitance (approximately 9pF) plus any
parasitic layout capacitance.
HEATSINKING METHOD
θ
JA
The part is soldered to a 2 oz copper pad under the
38
exposed pad.
Soldered to copper pad with forced airflow (150lfm).
36
Soldered to copper pad with forced airflow (250lfm).
35
Soldered to copper pad with forced airflow (500lfm).
34
6
5
4
3
2
1
0
Temperature (
°C)
MAXIMUM POWER DISSIPATION IN PACKAGE
vs TEMPERATURE
Power
Dissipated
(W)
–75
–50
0
–25
25
50
75
100
125
Thermal pad soldered
to 2oz. copper pad,
with 500lfm airlow.
Thermal pad soldered
to 2oz. copper pad,
without forced air.
T
J = 150°C
100
90
80
70
60
50
40
30
20
10
0
Thermal
Resistance,
θ
JA
(
°C/W)
0
123
45
6
Number of Thermal Vias
THERMAL RESISTANCE
vs NUMBER OF THERMAL VIAS
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| RMCF2010FT36R5 | RES 36.5 OHM 1% 3/4W 2010 SMD |
| RMCF2010FT33K2 | RES 33.2K OHM 1% 3/4W 2010 SMD |
| ESQT-104-03-F-D-310 | CONN SOCKET 8 POS DUAL ROW |
| RMCF2010FT2K49 | RES 2.49K OHM 1% 3/4W 2010 SMD |
| PPTC322LJBN-RC | CONN FEMALE 64POS DL .1" R/A TIN |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| OPA567AIRHGT | 制造商:Texas Instruments 功能描述:IC OP-AMP GP R-R 1.2MHZ 12VQFN |
| OPA567AIRHGTG4 | 功能描述:運(yùn)算放大器 - 運(yùn)放 Rail-to-Rail I/O 2A Power Amplifier RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA569 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Power Op Amp. Output Signal Swings Within 200mV of Rails at 2A Output Current |
| OPA569AIDWP | 功能描述:運(yùn)算放大器 - 運(yùn)放 2A Pwr Op Amp Rail-To-Rail I/O RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA569AIDWPG4 | 功能描述:運(yùn)算放大器 - 運(yùn)放 2A Pwr Op Amp Rail-To-Rail I/O RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。