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參數(shù)資料
| 型號(hào)： | OPA2333AIDRG4 |
| 英文描述： | 1.8V, microPOWER CMOS OPERATIONAL AMPLIFIERS Zer-PI Drift Series |
| 中文描述： | 1.8，微CMOS運(yùn)算放大器澤爾聚酰亞胺漂移系列 |
| 文件頁數(shù)： | 11/18頁 |
| 文件大?。?/td> | 478K |
| 代理商： | OPA2333AIDRG4 |
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SBOS351 MARCH 2006
www.ti.com
11
DFN PACKAGE
The OPA2333 is offered in an DFN-8 package (also known
as SON). The DFN is a QFN package with lead contacts
on only two sides of the bottom of the package. This
leadless package maximizes board space and enhances
thermal and electrical characteristics through an exposed
pad.
DFN packages are physically small, have a smaller routing
area, improved thermal performance, and improved
electrical parasitics. Additionally, the absence of external
leads eliminates bent-lead issues.
The DFN package can be easily mounted using standard
printed circuit board (PCB) assembly techniques. See
Application Note
QFN/SON PCB Attachment
(SLUA271)
and Application Report
Quad Flatpack No-Lead Logic
Packages
(SCBA017), both available for download at
www.ti.com.
The exposed leadframe die pad on the bottom of the
package should be connected to V or left
unconnected.
DFN LAYOUT GUIDELINES
The exposed leadframe die pad on the DFN package
should be soldered to a thermal pad on the PCB. A
mechanical drawing showing an example layout is
attached at the end of this data sheet. Refinements to this
layout may be necessary based on assembly process
requirements. Mechanical drawings located at the end of
this data sheet list the physical dimensions for the package
and pad. The five holes in the landing pattern are optional,
and are intended for use with thermal vias that connect the
leadframe die pad to the heatsink area on the PCB.
Soldering the exposed pad significantly improves
board-level reliability during temperature cycling, key
push, package shear, and similar board-level tests. Even
with applications that have low-power dissipation, the
exposed pad must be soldered to the PCB to provide
structural integrity and long-term reliability.
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| OPA2333 | 1.8V, microPOWER CMOS OPERATIONAL AMPLIFIERS Zer-PI Drift Series |
| OPA2333AID | 1.8V, microPOWER CMOS OPERATIONAL AMPLIFIERS Zer-PI Drift Series |
| OPA2335AIDGKR | 0.05UV/∑C max, SINGLE-SUPPLY CMOS OPERATIONAL AMPLIFIERS |
| OPA2334 | 0.05UV/∑C max, SINGLE-SUPPLY CMOS OPERATIONAL AMPLIFIERS |
| OPA2334AIDGSR | 0.05UV/∑C max, SINGLE-SUPPLY CMOS OPERATIONAL AMPLIFIERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| OPA2333AMDREP | 功能描述:運(yùn)算放大器 - 運(yùn)放 Mil Enhance 1.8V Micropwr CMOS Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA2333AMDREPG4 | 功能描述:運(yùn)算放大器 - 運(yùn)放 EP MICROPWR CHOPPER STABILIZED OP AMP RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA2333AQDGKRQ1 | 功能描述:運(yùn)算放大器 - 運(yùn)放 1.8V17uA2uVmicro PWR CMOS 0-Drift RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA2333AQDRQ1 | 功能描述:運(yùn)算放大器 - 運(yùn)放 1.8V,17uA,2uV,micro Pwr CMOS 0-Drift Ser RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA2333HD | 功能描述:運(yùn)算放大器 - 運(yùn)放 Hi Temperature 1.8-V MicroPWR CMOS Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
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