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參數(shù)資料
| 型號： | NT2GT72U4PD0BV-3C |
| 廠商： | NANYA TECHNOLOGY CORP |
| 元件分類： | DRAM |
| 英文描述： | 256M X 72 DDR DRAM MODULE, 0.45 ns, DMA240 |
| 封裝： | ROHS COMPLIANT, DIMM-240 |
| 文件頁數(shù)： | 6/27頁 |
| 文件大小： | 648K |
| 代理商： | NT2GT72U4PD0BV-3C |
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NT1GT72U89D0BV / NT2GT72U4PD0BV / NT4GT72U4ND0BV
NT2GT72U8PD0BV
1GB: 128M x 72 / 2GB: 256M x 72 / 4GB: 512M x 72
PC2-5300 / PC3-6400
Registered DDR2 SDRAM DIMM
REV 1.1
14
01/2009
NANYA TECHNOLOGY CORP.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
-3C
-AD
-3C
-AD
54
DRAM Case Temperature Rise from Ambient due to Active Power-
Down with Slow PDN Exit (DT3P slow)
Undefined
00
55
DRAM Case Temperature Rise from Ambient due to Page Open
Burst Read/DT4R4W Mode Bit (DT4R/DT4R4W Mode Bit)
Undefined
00
56
DRAM Case Temperature Rise from Ambient due to Burst Refresh
(DT5B)
Undefined
00
57
DRAM Case Temperature Rise from Ambient due to Bank
Interleave Reads with Auto-Precharge (DT7)
Undefined
00
58
Thermal Resistance of PLL Package from Top (Case) to Ambient
(Psi T-A PLL)
Undefined
00
59
Thermal Resistance of Register Package from Top (Case) to
Ambient (Psi T-A Register)
Undefined
00
60
PLL Case Temperature Rise from Ambient due to PLL Active (DT
PLL Active)
Undefined
00
61
Resister Case Temperature Rise from Ambient due to Register
Active/Mode Bit (DT Register Active/Mode Bit)
Undefined
00
62
SPD Revision
1.3
13
63
Checksum for Byte 0-62
Checksum Data
41
0B
64-71
Manufacturer’s JEDEC ID Code
Nanya
72
Module Manufacturing Location
Manufacturing code
--
73-91
Module Part Number
Module Part Number in ASCII
--
92-255
Reserved
Undefined
--
Note1:
NT2GT72U8PD0BV-3C -> 4E543247543732553850443042562D33432020
NT2GT72U8PD0BV-AD -> 4E543247543732553850443042562D41442020
7F7F7F0B00000000
Serial Presence Detect (Part 1 of 2) [NT2GT72U8PD0BV, 2GB – 2 Ranks, 128Mx8 DDR2 SDRAMs]
Byte
Description
SPD Entry Value
Serial PD Data Entry (Hex.)
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| NT5CB256M4AN-BF | DDR DRAM, PBGA78 |
| NT5DS64M8BF-6KI | DDR DRAM, PBGA60 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NT2H0301F0DTL,125 | 功能描述:RFID應(yīng)答器 RoHS:否 制造商:NXP Semiconductors 存儲容量: 工作溫度范圍: 安裝風(fēng)格: 封裝 / 箱體: 封裝:Reel |
| NT2H0301F0DTP,118 | 制造商:NXP Semiconductors 功能描述:NT2H0301F0DTP - Tape and Reel 制造商:NXP Semiconductors 功能描述:PHANT2H0301F0DTP,118 NFC FORUM TYPE 2 TA 制造商:NXP Semiconductors 功能描述:IC SMART TAG NFC TYPE 2 8HWSON 制造商:NXP Semiconductors 功能描述:NT2H0301F0DTP/HWSON8/REEL13// |
| NT2H0301F0DTP,147 | 制造商:NXP Semiconductors 功能描述:CHIPSET |
| NT2H0301F0DUDV | 制造商:NXP Semiconductors 功能描述:CHIPSET |
| NT2H0301G0DUD,005 | 制造商:NXP Semiconductors 功能描述:NT2H0301G0DUD/UNCASED/FOIL// - Gel-pak, waffle pack, wafer, diced wafer on film 制造商:NXP Semiconductors 功能描述:IC SMART TAG NFC TYPE 2 UNCASED |
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