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參數(shù)資料
| 型號(hào)： | NIS5112D2R2G |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 電源管理 |
| 英文描述： | Electronic Fuse |
| 中文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 |
| 封裝： | LEAD FREE, SOIC-8 |
| 文件頁數(shù)： | 2/9頁 |
| 文件大小： | 102K |
| 代理商： | NIS5112D2R2G |
NIS5112
http://onsemi.com
2
Table 1. FUNCTIONAL PIN DESCRIPTION
Pin
Function
Description
3
Enable/Timer
A high level signal on this pin allows the device to begin operation. Connection of a capacitor will delay
turn on for timing purposes. A low input signal inhibits the operation.
1
Ground
Negative input voltage to the device. This is used as the internal reference for the IC.
4
I
Limit
A resistor between this pin and the source pin sets the current limit level.
5,6,7
Source
Source of power FET, which is also the switching node for the load.
2
dV/dt
A capacitor from this pin to ground programs the slew rate of the output at turn on. This capacitor is
discharged by an internal discharge circuit when the device is disabled via the enable pin.
8
V
CC
Positive input voltage to the device.
Table 2. MAXIMUM RATINGS
(Maximum ratings are those, that, if exceeded, may cause damage to the device. Electrical
characteristics are not guaranteed over this range)
Rating
Symbol
Value
Unit
Input Voltage, Operating,
SteadyState (Input+ to Input)
Transient (Conditions 1 ms)
V
in
0.3 to 18
0.3 to 25
V
Drain Voltage, Operating,
SteadyState (Drain to Input)
Transient (Conditions 1 ms)
V
DD
0.3 to 18
0.3 to 25
V
Drain Current, Peak (Internally Clamped)
I
Dpk
25
A
Drain Current, Continuous (T
A
=25
°
C), (Note 2)
I
Davg
5.3
A
Thermal Resistance, JunctiontoAir
0.5 in
2
Copper
1.0 in
2
Copper
Q
JA
120
110
°
C/W
°
C/W
Thermal Resistance, JunctiontoLead (Pin 8)
Q
JL
27
°
C/W
Power Dissipation (T
A
= 25
°
C) (Note 1)
P
max
1.0
W
Operating Temperature Range (Note 2)
T
J
40 to 175
°
C
Nonoperating Temperature Range
T
J
55 to 175
°
C
Lead Temperature, Soldering (10 Sec)
T
L
260
°
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Mounted on FR4 board, 1 in sq pad, 1 oz coverage.
2. Actual maximum junction temperature is limited by an internal protection circuit and will not reach the absolute maximum temperature as
specified.
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