參數(shù)資料
型號(hào)： NCN8024RDWR2G
廠商： ON Semiconductor
文件頁數(shù)： 11/15頁
文件大?。?/td> 0K
描述： IC SMART CARD IC2 28SOIC
標(biāo)準(zhǔn)包裝： 1,000
系列： *
NCN8024R
http://onsemi.com
5
ATTRIBUTES
Characteristics
Values
ESD protection
Human Body Model (HBM) (Note 1)
Card Pins (Card Interface Pins 9 17)
All Other Pins
Machine Model (MM)
Card Pins (Card Interface Pins 9 17)
All Other Pins
8 kV
2 kV
400 V
150 V
Moisture sensitivity (Note 2) SOIC28 and TSSOP28
Level 3
Flammability Rating Oxygen
Index: 28 to 34
UL 94 V0 @ 0.125 in
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. Human Body Model (HBM), R = 1500 W, C = 100 pF.
2. For additional information, see Application Note AND8003/D.
MAXIMUM RATINGS (Note 3)
Rating
Symbol
Value
Unit
DC/DC Converter Power Supply Voltage
VDDP
0.3 v VDDP v 5.5
V
Power Supply from Microcontroller Side
VDD
0.3 v VDD v 5.5
V
External Card Power Supply
CRD_VCC
0.3 v CRD_VCC v 5.5
V
Charge Pump Output
VUP
0.3 v VUP v 5.5
Digital Input Pins
Vin
0.3 v Vin v VDD
V
Digital Output Pins (I/Ouc, AUX1uc, AUX2uc, INT)
Vout
0.3 v Vout v VDD
V
Smart Card Output Pins
Vout
0.3 v Vout v CRD_VCC
V
Thermal Resistance JunctiontoAir
SOIC28
TSSOP28
RqJA
75
76
°C/W
Operating Ambient Temperature Range
TA
40 to +85
°C
Operating Junction Temperature Range
TJ
40 to +125
°C
Maximum Junction Temperature
TJmax
+125
°C
Storage Temperature Range
Tstg
65 to + 150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C
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