參數(shù)資料
型號: MT58L128L36P1T-5
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: SRAM
英文描述: 128K X 36 CACHE SRAM, 2.8 ns, PQFP100
封裝: PLASTIC, MS-026, TQFP-100
文件頁數(shù): 1/30頁
文件大小: 481K
代理商: MT58L128L36P1T-5
1
4Mb: 256K x 18, 128K x 32/36 Pipelined, SCD SyncBurst SRAM
2003, Micron Technology, Inc.
MT58L256L18P1_F.p65 – Rev. F, Pub. 1/03 EN
4Mb: 256K x 18, 128K x 32/36
PIPELINED, SCD SYNCBURST SRAM
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.
FEATURES
Fast clock and OE# access times
Single +3.3V +0.3V/-0.165V power supply (VDD)
Separate +3.3V or +2.5V isolated output buffer
supply (VDDQ)
SNOOZE MODE for reduced-power standby
Single-cycle deselect (Pentium BSRAM-compatible)
Common data inputs and data outputs
Individual BYTE WRITE control and GLOBAL WRITE
Three chip enables for simple depth expansion
and address pipelining
Clock-controlled and registered addresses, data
I/Os and control signals
Internally self-timed WRITE cycle
Burst control pin (interleaved or linear burst)
Automatic power-down for portable applications
165-pin FBGA package
100-pin TQFP package
Low capacitive bus loading
x18, x32, and x36 versions available
OPTIONS
MARKING
Timing (Access/Cycle/MHz)
2.6ns/4.4ns/225 MHz
-4.4
2.8ns/5ns/200 MHz
-5
3.5ns/6ns/166 MHz
-6
4.0ns/7.5ns/133 MHz
-7.5
5ns/10ns/100 MHz
-10
Configurations
3.3V I/O
256K x 18
MT58L256L18P1
128K x 32
MT58L128L32P1
128K x 36
MT58L128L36P1
2.5V I/O
256K x 18
MT58L256V18P1
128K x 32
MT58L128V32P1
128K x 36
MT58L128V36P1
Packages
100-pin TQFP
T
165-pin FBGA
F*
Operating Temperature Range
Commercial (0°C to +70°C)
None
Industrial (-40°C to +85°C)**
IT
Part Number Example:
MT58L256L18P1T-6
MT58L256L18P1, MT58L128L32P1,
MT58L128L36P1; MT58L256V18P1,
MT58L128V32P1, MT58L128V36P1
3.3V VDD, 3.3V or 2.5V I/O, Pipelined, Single-Cycle
Deselect
4Mb SYNCBURST
SRAM
** Industrial temperature range offered in specific speed grades and
configurations. Contact factory for more information.
GENERAL DESCRIPTION
The Micron SyncBurst SRAM family employs
high-speed, low-power CMOS designs that are fabri-
cated using an advanced CMOS process.
Micron’s 4Mb SyncBurst SRAMs integrate a
256K x 18, 128K x 32, or 128K x 36 SRAM core with ad-
vanced synchronous peripheral circuitry and a 2-bit
burst counter. All synchronous inputs pass through
registers controlled by a positive-edge-triggered single
clock input (CLK). The synchronous inputs include all
addresses, all data inputs, active LOW chip enable
NOTE: 1. JEDEC-standard MS-026 BHA (LQFP).
2. The 165-ball FBGA is not recommended for new
designs in the 4Mb density.
100-PIN TQFP1
165-BALL FBGA2
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