參數(shù)資料
型號： MT48H8M16LFB4-8IT:JTR
元件分類： DRAM
英文描述： 8M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54
封裝： 8 X 8 MM, LEAD FREE, VFBGA-54
文件頁數(shù)： 28/61頁
文件大?。?/td> 2469K
PDF: 09005aef8237e877/Source: 09005aef8237e8d8
Micron Technology, Inc., reserves the right to change products or specifications without notice.
128Mb_x16 Mobile SDRAM_Y25M_2.fm - Rev. A 6/06 EN
34
2006 Micron Technology, Inc. All rights reserved.
128Mb: x16 Mobile SDRAM
Power-Down
Preliminary
Notes:
1. CKEn is the logic state of CKE at clock edge n; CKEn-1 was the state of CKE at the previous
clock edge.
2. Current state is the state of the SDRAM immediately prior to clock edge n.
3. COMMANDn is the command registered at clock edge n, and ACTIONn is a result of COM-
MANDn.
4. All states and sequences not shown are illegal or reserved.
5. Exiting power-down at clock edge n will put the device in the all banks idle state in time for
clock edge n + 1 (provided that tCKS is met).
6. Exiting self refresh at clock edge n will put the device in the all banks idle state once tXSR is
met. COMMAND INHIBIT or NOP commands should be issued on any clock edges occurring
during the tXSR period. A minimum of two NOP commands must be provided during tXSR
period.
7. After exiting clock suspend at clock edge n, the device will resume operation and recognize
the next command at clock edge n + 1.
8. Deep power-down is a power-saving feature of this Mobile SDRAM device. This command is
BURST TERMINATE when CKE is HIGH and DEEP POWER-DOWN when CKE is LOW.
Table 7:
Truth Table 2 – CKE
Notes: 1-4; Notes appear below table.
CKEn-1
CKEn
Current State
Commandn
Actionn
Notes
L
Power-Down
X
Maintain Power-Down
Self Refresh
X
Maintain Self Refresh
Clock Suspend
X
Maintain Clock Suspend
Deep Power-Down
X
Maintain Deep Power-Down
8
L
H
Power-Down
COMMAND INHIBIT or NOP
Exit Power-Down
5
Deep Power-Down
X
Exit Deep Power-Down
8
Self Refresh
COMMAND INHIBIT or NOP
Exit Self Refresh
6
Clock Suspend
X
Exit Clock Suspend
7
H
L
All Banks Idle
COMMAND INHIBIT or NOP
Power-Down Entry
All Banks Idle
BURST TERMINATE
Deep Power-Down Entry
8
All Banks Idle
AUTO REFRESH
Self Refresh Entry
Reading or Writing
VALID
Clock Suspend Entry
H
See Truth Table 3
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MT48H8M16LFF3-7E 制造商:Micron Technology Inc 功能描述:
MT48H8M16LFF4-10 功能描述:IC SDRAM 128MBIT 100MHZ 54VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲器:RAM 存儲器類型:SDRAM 存儲容量:256M（8Mx32） 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA（8x13） 包裝:托盤 其它名稱:Q2841869
MT48H8M16LFF4-10 IT 功能描述:IC SDRAM 128MBIT 100MHZ 54VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲器:RAM 存儲器類型:SDRAM 存儲容量:256M（8Mx32） 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA（8x13） 包裝:托盤 其它名稱:Q2841869
MT48H8M16LFF4-8 功能描述:IC SDRAM 128MBIT 125MHZ 54VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲器:RAM 存儲器類型:SDRAM 存儲容量:256M（8Mx32） 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA（8x13） 包裝:托盤 其它名稱:Q2841869
MT48H8M16LFF4-8 IT 功能描述:IC SDRAM 128MBIT 125MHZ 54VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲器:RAM 存儲器類型:SDRAM 存儲容量:256M（8Mx32） 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA（8x13） 包裝:托盤 其它名稱:Q2841869
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