參數(shù)資料
型號: MT46V64M4TG-75E
元件分類: DRAM
英文描述: 64M X 4 DDR DRAM, 0.75 ns, PDSO66
封裝: 0.400 INCH, PLASTIC, TSOP-66
文件頁數(shù): 79/83頁
文件大?。?/td> 2343K
代理商: MT46V64M4TG-75E
256Mb: x4, x8, x16
DDR SDRAM
09005aef8076894f
Micron Technology, Inc., reserves the right to change products or specifications without notice.
256MBDDRx4x8x16_2.fm - Rev. K 9/04 EN
80
2003 Micron Technology, Inc. All rights reserved.
Figure 52: Bank Write - With Auto Precharge
NOTE:
1. DIn = data-out from column n; subsequent elements are provided in the programmed order.
2. Burst length = 4 in the case shown.
3. Enable auto precharge.
4. ACT = ACTIVE;, RA = Row Address; and BA = Bank Address.
5. NOP commands are shown for ease of illustration; other commands may be valid at these times.
6. See Figure 43, Data Input Timing, on page 71, for detailed DQ timing.
7. Although not required by the Micron device, JEDEC specifies that DQS be a valid HIGH, LOW or some point on a valid
transition on or before this clock edge (T3n).
CK
CK#
CKE
A10
BA0, BA1
tCK
tCH
tCL
tIS
tIH
tIS
tIH
tIS
tIH
RA
tRCD
tRAS
tRP
tWR
T0
T1
T2
T3
T4
T5
T5n
T6
T7
T8
T4n
NOP5
COMMAND4
3
ACT
RA
Col n
WRITE2
NOP5
Bank x
NOP5
Bank x
NOP5
tDQSL tDQSH tWPST
DQ1
DQS
DM
DI
b
tDS
tDH
tDQSS (NOM)
DON’T CARE
TRANSITIONING DATA
tWPRES tWPRE
x4: A0-A9, A11
x8: A0-A9
x16: A0-A8
x4: A12
x8: A11, A12
x16: A9, A11, A12
T3n
7
-5B
-6/6
-75E/75Z
-75
SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX UNITS
tCH
0.45 0.55 0.45 0.55 0.45
0.55
0.45
0.55
tCK
tCL
0.45 0.55 0.45 0.55 0.45
0.55
0.45
0.55
tCK
tCK (3)
57.5
–––
ns
tCK (2.5)
6
13
6
13
7.5
13
7.5
13
ns
tCK (2)
7.5
13
7.5
13
7.5
13
10
13
ns
tDH
0.40
0.45
0.5
ns
tDS
0.40
0.45
0.5
ns
tDQSH
0.35
tCK
tDQSL
0.35
tCK
tDQSS
0.72 1.28 0.75 1.25 0.75
1.25
0.75
1.25
tCK
tDSS
0.2
tCK
tDSH
0.2
tCK
tIH
S
0.6
0.8
1
ns
tIS
S
0.6
0.8
1
ns
tRAS
40
70,000
42
70,000
40
120,000
40
120,000
ns
tRCD
15
20
ns
tRP
15
20
ns
tWPRE
0.25
tCK
tWPRES
00
0
ns
tWPST
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
tCK
tWR
15
ns
-5B
-6/6
-75E/75Z
-75
SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX UNITS
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