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| 型號(hào)： | MT46V128M4P-75ZLIT:C |
| 元件分類： | DRAM |
| 英文描述： | 128M X 4 DDR DRAM, 0.75 ns, PDSO66 |
| 封裝： | 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 |
| 文件頁(yè)數(shù)： | 92/94頁(yè) |
| 文件大?。?/td> | 4179K |
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09005aef80a1d9e7
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512MBDDRx4x8x16_2.fm - Rev. J 1/06 EN
92
2000–2005 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR SDRAM
Timing Diagrams
Figure 53:
Write - DM Operation
Notes: 1. DIn = data-in from column n; subsequent elements are provided in the programmed order.
2. Burst length = 4 in the case shown.
3. Disable auto precharge.
4. “Don’t Care” if A10 is HIGH at T8.
5. PRE = PRECHARGE, ACT = ACTIVE, RA = Row Address, BA = Bank Address.
6. NOP commands are shown for ease of illustration; other commands may be valid at these
times.
7. See Figure 43 on page 81 for detailed DQ timing.
CK
CK#
CKE
A10
BA0, BA1
tCK
tCH
tCL
tIS
tIH
tIS
tIH
tIS
tIH
RA
tRCD
tRAS
tRP
tWR
T0
T1
T2
T3
T4
T5
T5n
T6
T7
T8
T4n
NOP6
COMMAND5
3
ACT
RA
Col n
WRITE2
NOP6
ONE BANK
ALL BANKS
Bank x
PRE
Bank x
NOP6
tDQSL tDQSH tWPST
Bank x4
DQ1
DQS
DM
DI
b
tDS
tDH
DON’T CARE
TRANSITIONING DATA
tDQSS (NOM)
tWPRES tWPRE
x8: A12
x16: A11, A12
x4: A0–A9, A11, A12
x8: A0–A9, A11
x16: A0–A9
相關(guān)PDF資料 |
PDF描述 |
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| MT46V64M4TG-75E | 64M X 4 DDR DRAM, 0.75 ns, PDSO66 |
| MT46V64M4FG-75Z | 64M X 4 DDR DRAM, 0.75 ns, PBGA60 |
| MT47H128M8HQ-3AT | 128M X 8 DDR DRAM, 0.4 ns, PBGA60 |
| MT47H64M16HR-3IT | 64M X 16 DDR DRAM, 0.4 ns, PBGA84 |
| MT48H8M16LFB4-8IT:JTR | 8M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MT46V128M4T67A3WC1 | 制造商:Micron Technology Inc 功能描述:128MX4 DDR SDRAM DIE-COM COMMERCIAL 2.5V - Trays |
| MT46V128M4TG-5B/D | 制造商:Samsung Semiconductor 功能描述: |
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