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Micron Technology, Inc., reserves the right to change products or specifications without notice.
512MBDDRx4x8x16_2.fm - Rev. J 1/06 EN
81
2000–2005 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR SDRAM
Notes
Figure 42:
Data Output Timing – tAC and tDQSCK
Notes: 1. tDQSCK is the DQS output window relative to CK and is the “l(fā)ong term” component of
DQS skew.
2. DQ transitioning after DQS transition define tDQSQ window.
3. All DQ must transition by tDQSQ after DQS transitions, regardless of tAC.
4. tAC is the DQ output window relative to CK, and is the “l(fā)ong term” component of
DQ skew.
5. tLZ (MIN) and tAC (MIN) are the first valid signal transition.
6. tHZ (MAX), and tAC (MAX) are the latest valid signal transition.
7. READ command with CL = 2 issued at T0.
Figure 43:
Data Input Timing
Notes: 1. tDSH (MIN) generally occurs during tDQSS (MIN).
2. tDSS (MIN) generally occurs during tDQSS (MAX).
3. WRITE command issued at T0.
4. For x16, LDQS controls the lower byte and UDQS controls the upper byte.
CK
CK#
DQS, or LDQS/UDQS2
T07
T1
T2
T3
T4
T5
T2n
T3n
T4n
T5n
T6
tRPST
tLZ (MIN)
tDQSCK1 (MAX)
tDQSCK1 (MIN)
tDQSCK1 (MAX)
tDQSCK1 (MIN)
tHZ(MAX)
tRPRE
DQ (Last data valid)
DQ (First data valid)
All DQ values, collectively3
tAC4 (MIN)
tAC4 (MAX)
tLZ (MIN)
tHZ (MAX)
T2
T2n
T3n
T4n
T5n
T2n
T3n
T4n
T5n
T3
T4
T5
T2
T3
T4
T5
T3
DQS
tDQSS
tDQSH tWPST
tDH
tDS
tDQSL
tDSS2 tDSH1
tDSH1
tDSS2
DM
DQ
CK
CK#
T03
T1
T1n
T2
T2n
T3
DI
b
DON’T CARE
TRANSITIONING DATA
tWPRE
tWPRES