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Micron Technology, Inc., reserves the right to change products or specifications without notice.
512MBDDRx4x8x16_2.fm - Rev. J 1/06 EN
75
2000–2005 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR SDRAM
Notes
C. The full driver pull-up current variation from MIN to MAX process, temperature
and voltage will lie within the outer bounding lines of the V-I curve of
Figure 39.D. The driver pull-up current variation, within nominal voltage and temperature
limits, is expected, but not guaranteed, to lie within the inner bounding lines of
E. The full ratio variation of the MAX to MIN pull-up and pull-down current should
be between 0.71 and 1.4 for device drain-to-source voltages from 0.1V to 1.0V at
the same voltage and temperature.
F. The full ratio variation of the nominal pull-up to pull-down current should be
unity ±10 percent, for device drain-to-source voltages from 0.1V to 1.0V.
Figure 38:
Reduced Drive Pull-Down Characteristics
Figure 39:
Reduced Drive Pull-Up Characteristics
39. The voltage levels used are derived from a minimum VDD level and the referenced test
load. In practice, the voltage levels obtained from a properly terminated bus will pro-
vide significantly different voltage values.
0
20
40
60
80
100
120
140
160
0.0
0.5
1.0
1.5
2.0
2.5
VOUT (V)
IOUT
(m
A
)
-200
-180
-160
-140
-120
-100
-80
-60
-40
-20
0
0.0
0.5
1.0
1.5
2.0
2.5
IOUT
(mA)
VDDQ - VOUT (V)