參數(shù)資料
型號： MT46V128M4FN-75E:C
元件分類： DRAM
英文描述： 128M X 4 DDR DRAM, 0.75 ns, PBGA60
封裝： 10 X 12.50 MM, FBGA-60
文件頁數(shù)： 94/94頁
文件大?。?/td> 4179K
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
for production devices. Although considered final, these specifications are subject to change, as further product
development and data characterization sometimes occur.
512Mb: x4, x8, x16 DDR SDRAM
Package Dimensions
09005aef80a1d9e7
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512MBDDRx4x8x16_2.fm - Rev. J 1/06 EN
94
2000–2005 Micron Technology, Inc. All rights reserved.
Figure 55:
60-Ball FBGA (10 x 12.5mm)
Note:
All dimensions are in millimeters.
BALL #1 ID
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: .33
NON SOLDER MASK DEFINED
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
1.20 MAX
0.85 ±0.05
0.10 C
C
SEATING PLANE
BALL A1 ID
BALL A1
CL
.45
60X
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-REFLOW
DIAMETER IS 0.40.
BALL A9
11.00
5.50 ±0.05
6.25 ±0.05
12.50 ±0.10
1.00
TYP
6.40
1.80
CTR
0.80 (TYP)
3.20 ±0.05
5.00 ±0.05
10.00 ±0.10
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