
APPLICATION NOTES CONT.
4
To select a heat sink for the MSK 5821RH, the follow-
ing formula for convective heat flow may be used.
Governing Equation:
T
J
=
P
D
X (R
θ
J C
+ R
θ
CS
+ R
θ
SA
) + T
A
Where
T
J
P
D
R
θ
J C
R
θ
CS
R
θ
SA
T
A
= J unction Temperature
= Total Power Dissipation
= J unction to Case Thermal Resistance
= Case to Heat Sink Thermal Resistance
= Heat Sink to Ambient Thermal Resistance
= Ambient Temperature
Power Dissipation= (VIN-VOUT) x I
OUT
Next, the user must select a maximum junction tem-
perature. The absolute maximum allowable junction tem-
perature is 150°C. The equation may now be rearranged
to solve for the required heat sink to ambient thermal
resistance (R
θ
SA
).
Example:
An MSK 5827RH is connected for VIN= + 3.3V and
VOUT= + 2.5V. I
OUT
is a continuous 3A DC level. The
ambient temperature is + 25°C. The maximum desired
junction temperature is + 125° C.
R
θ
J C
= 4.0° C/W and R
θ
CS
= 0.15° C/W for most thermal
greases
Power Dissipation= (3.3V-2.5V) x (3A)
= 2.4Watts
Solve for R
θ
SA:
125° C - 25° C
= 36.5° C/W
In this example, a heat sink with a thermal resistance
of no more than 36.5° C/W must be used to maintain a
junction temperature of no more than 125° C.
OUTPUT VOLTAGE SELECTION
As noted in the above typical applications circuit, the
formula for output voltage selection is
A good starting point for this output voltage selection is
to set R2= 1K. By rearranging the formula it is simple to
calculate the final R1 value.
Table 1 below lists some of the most probable resistor
combinations based on industry standard usage.
R1
R2
1+
VOUT= 1.265
VOUT
R1= R2
R
θ
SA
2.4W
The MSK 5827RH control circuitry has a thermal shut-
down temperature of approximately 150° C. This ther-
mal shutdown can be used as a protection feature, but
for continuous operation, the junction temperature of the
pass transistor must be maintained below 150°C. Proper
heat sink selection is essential to maintain these condi-
tions. Exceeding the thermal limit activates the latch fea-
ture of the MSK 5827RH. Toggle the shutdown pin high
then low or cycle power to reset the latch. See SHUT-
DOWN pin description and overcurrent latch description
for more information.
THERMAL LIMITING
HEAT SINK SELECTION
TYPICAL APPLICATIONS CIRCUIT
1.5
1.8
2.0
2.5
2.8
3.3
4.0
5.0
1K
1K
1K
1K
1K
1K
1K
1K
187
422
576
976
1.21K
1.62K
2.15K
2.94K
OUTPUT VOLTAGE
(V)
TABLE 1
R2
(
)
R1 (nearest 1%)
(
)
Radiation performance curves for TID testing have been
generated for all radiation testing performed by MS
Kennedy. These curves show performance trends
throughout the TID test process and can be located in
the MSK 5810RH radiation test report. The complete
radiation test report is available in the RAD HARD PROD-
UCTS section on the MSK website.
TOTAL DOSE RADIATION TEST
PERFORMANCE
http://www.mskennedy.com/store.asppid=9951&catid=19680
Rev. B 1/10