參數(shù)資料
型號： MSC7112VM800
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 數(shù)字信號處理
英文描述： 32-BIT, 200 MHz, OTHER DSP, PBGA400
封裝： 17 X 17 MM, LEAD FREE, BGA-400
文件頁數(shù)： 32/56頁
文件大?。?/td> 1489K
代理商： MSC7112VM800
M
SC7
1
2
Low-Cos
t1
6
-bit
DSP
with
DDR
Control
le
rDa
ta
She
e
t,
Re
v
.1
1
Ha
rd
w
a
re
Des
ign
C
o
nsi
d
erati
ons
Fre
es
c
a
le
Sem
ico
nd
uct
or
38
3
H
ar
dwar
e
Des
ign
Conside
rations
Th
is
section
des
cribed
variou
sareas
t
o
con
sid
er
when
incor
por
at
in
g
the
M
S
C
7
1
2
d
evice
into
as
y
st
em
des
ig
n
.
3.1
T
h
ermal
De
sign
Con
sideration
s
An
es
tim
atio
n
o
f
th
ech
ip
-ju
n
ctio
n
tem
p
er
at
u
re
,T
J ,
in
°
C
can
b
eo
b
tain
ed
fr
o
m
th
ef
o
ll
o
w
in
g
:
T
J
=
T
A
+
(R
θ
JA
×
P
D
)E
q
n
.
1
wh
er
e
T
A
=
amb
ien
ttemperatu
re
nea
rthe
p
ackage
(°
C)
Rθ
JA
=
ju
n
ctio
n
-to
-a
m
b
ien
tth
er
m
al
r
esis
tan
ce
(°
C/
W)
P
D
=
P
INT
+
P
I/
O
=
p
o
wer
d
is
sip
atio
n
in
the
packag
e(W
)
P
INT
=
I
DD
×
V
DD
=
in
ter
n
al
p
o
w
er
d
iss
ip
at
io
n
(
W
)
P
I/
O
=
pow
er
di
ss
ip
at
ed
fro
m
dev
ice
on
out
p
u
tpi
ns
(W
)
Th
ep
o
w
er
d
iss
ip
at
io
n
v
alu
es
f
o
r
th
eMSC
7
1
2
ar
elis
ted
in
Ta
.Th
eambien
t
te
m
p
eratu
re
fo
rthe
d
evice
is
the
air
temp
erature
in
the
imm
ediate
vicinity
th
at
would
cool
th
edev
ice.
The
ju
nction-
to
-amb
ient
ther
mal
res
is
tances
are
JE
DEC
st
andar
d
v
al
u
es
th
at
pro
v
ide
aquick
and
eas
y
es
timation
of
th
erm
al
perfo
rman
ce.
The
re
are
two
values
in
co
mmo
n
us
age:
th
e
v
al
u
edeter
m
ined
o
n
a
si
ng
le
layer
b
o
ard
and
the
v
al
u
eob
tai
n
ed
o
n
a
b
o
ard
wit
h
two
p
lan
es
.The
v
alue
that
m
o
re
c
lo
sely
ap
pro
x
imates
as
p
ecific
a
p
plication
depen
d
son
the
power
dis
sip
at
ed
b
y
ot
he
rc
om
p
on
en
ts
on
t
h
e
p
rint
ed
c
ir
cui
t
b
o
ard
(P
CB
).
Th
eva
lu
eob
tained
us
in
g
as
in
g
le
lay
er
b
o
ard
is
app
rop
riate
fo
rtigh
tly
p
acked
PC
B
con
figur
at
io
ns
.Th
eva
lu
eo
b
ta
in
ed
us
in
g
a
b
o
ard
wi
th
intern
al
planes
is
more
appr
opr
iate
f
o
r
b
o
ar
d
s
w
ith
lo
w
p
o
wer
d
iss
ip
at
io
n
(
less
th
an
0
.0
2
W
/cm
2
with
n
at
u
ra
l
co
n
v
ectio
n
)an
d
well
s
ep
ar
ated
co
m
p
o
n
en
ts
.Bas
ed
o
n
an
estim
atio
n
o
fju
n
ctio
n
tem
p
er
atu
re
u
sin
g
th
is
tech
n
iq
u
e,
d
eter
m
in
e
wheth
er
a
m
o
re
d
etai
led
therma
l
analys
is
req
u
ired.
S
tan
dard
therm
al
manag
ement
techn
iques
can
be
u
sed
to
main
ta
in
the
d
ev
ice
th
er
m
al
ju
n
ct
io
n
tem
p
er
atu
re
b
elo
w
its
m
ax
im
u
m
.
If
T
J
app
ears
to
b
etoo
high
,either
lower
the
ambien
t
temperatu
re
o
r
the
power
dis
sipation
of
t
h
e
chip
.
Y
o
u
can
v
erify
the
ju
nction
temperatu
re
b
y
m
eas
u
ring
the
cas
etemp
eratur
eus
ing
as
m
all
diam
et
er
ther
mocou
p
le
(
40
gaug
eis
re
commen
d
ed)
or
an
inf
rared
temperatu
re
s
ens
or
o
n
a
sp
ot
on
the
d
evice
cas
e.
Us
e
th
efo
ll
o
w
in
g
eq
uation
to
determ
ine
T
J :
T
J
=
T
+
(Ψ
JT
×
P
D
)E
q
n
.
2
wh
er
e
T
T =
therm
o
cou
p
le
(o
rinf
rared
)temp
er
ature
o
n
to
p
of
the
p
ackage
(°
C)
Ψ
JT
=
ther
mal
char
acterizati
o
n
p
arameter
(°
C/W
)
P
D
=
p
o
wer
d
is
si
p
ation
in
the
p
ackage
(
W
)
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not
available from Freescale for import or sale in the United States prior to September 2010: MSC711XADS
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