參數(shù)資料
型號： MPC5553EVBE
廠商： Freescale Semiconductor
文件頁數(shù)： 56/68頁
文件大小： 0K
描述： BOARD EVAL FOR MPC5553
產(chǎn)品培訓模塊： MPC55xx PitchPak Family
標準包裝： 1
類型： MCU
適用于相關產(chǎn)品： MPC5553
所含物品： 評估板和演示軟件
配用： MFR4310FRDC-ND - FRDC FLEXRAY DAUGHTER CARD
相關產(chǎn)品： MPC5553MZQ132-ND - IC MCU MPC5553 REV A 324-PBGA
MPC5553MZP132-ND - IC MCU MPC5553 REV A 416-PBGA
MPC5553 Microcontroller Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor
6
3.2
Thermal Characteristics
The shaded rows in the following table indicate information specific to a four-layer board.
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TA = ambient temperature for the package (oC)
RJA = junction to ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Table 3. MPC5553 Thermal Characteristics
Spec
MPC5553 Thermal Characteristic
Symbol
Packages
Unit
208
MAPBGA
324
PBGA
416
PBGA
1
Junction to ambient, natural convection (one-layer board) 1, 2
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
RJA
41
30
29
°C/W
2
Junction to ambient, natural convection 1, 3
(four-layer board 2s2p)
3 Per JEDEC JESD51-6 with the board horizontal.
RJA
25
21
°C/W
3
Junction to ambient (@200 ft./min., one-layer board)
RJMA
33
24
23
°C/W
4
Junction to ambient (@200 ft./min., four-layer board 2s2p)
RJMA
22
17
18
°C/W
5
Junction to board (four-layer board 2s2p) 4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RJB
15
12
13
°C/W
6
Junction to case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
RJC
78
9
°C/W
7
Junction to package top, natural convection 6
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
JT
22
2
°C/W
相關PDF資料
PDF描述
MPC8323E-MDS-PB BOARD MODULE DEV SYSTEM 8323
MPC5534EVBE BOARD EVAL FOR MPC5534
MPC8313E-RDBB BOARD CPU 8313E VER 2.1
STD12W-T WIRE & CABLE MARKERS
STD12W-X WIRE & CABLE MARKERS
相關代理商/技術參數(shù)
參數(shù)描述
MPC5553EVBE 制造商:Freescale Semiconductor 功能描述:MPC55xxEVB: MPC55xx Evaluation
MPC5553EVBGHS 功能描述:開發(fā)軟件 GREEN HILLS SW Qorivva RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors
MPC5553EVBISYS 功能描述:開發(fā)軟件 ISYSTEMS CONTENT Qorivva RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors
MPC5553MVF112 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
MPC5553MVF112R2 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*