參數(shù)資料
型號: MCF5232
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: Integrated Microprocessor Hardware Specification
中文描述: 集成的微處理器,硬件規(guī)格
文件頁數(shù): 18/60頁
文件大?。?/td> 1462K
代理商: MCF5232
MCF523x Integrated Microprocessor Hardware Specification, Rev. 1.3
Preliminary
Design Recommendations
Freescale Semiconductor
18
4.2
Power Supply
33
μ
F, .1
μ
F and .01
μ
F across each power supply
4.3
Decoupling
Place the decoupling caps as close to the pins as possible, but they can be outside the footprint of
the package.
.1
μ
F and .01
μ
F at each supply input
4.4
Buffering
Use bus buffers on all data/address lines for all off-board accesses and for all on-board accesses
when excessive loading is expected. See
Section 6, “Preliminary Electrical Characteristics
.”
4.5
Pull-up Recommendations
Use external pull-up resistors on unused inputs. See pin table.
4.6
Clocking Recommendations
Use a multi-layer board with a separate ground plane.
Place the crystal and all other associated components as close to the EXTAL and XTAL
(oscillator pins) as possible.
Do not run a high frequency trace around crystal circuit.
Ensure that the ground for the bypass capacitors is connected to a solid ground trace.
Tie the ground trace to the ground pin nearest EXTAL and XTAL. This prevents large loop
currents in the vicinity of the crystal.
Tie the ground pin to the most solid ground in the system.
Do not connect the trace that connects the oscillator and the ground plane to any other circuit
element. This tends to make the oscillator unstable.
Tie XTAL to ground when an external oscillator is clocking the device.
4.7
Interface Recommendations
4.7.1
SDRAM Controller
4.7.1.1
Table 4
shows the behavior of SDRAM signals in synchronous mode.
SDRAM Controller Signals in Synchronous Mode
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