參數(shù)資料
型號(hào): MC33882
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: Six-Output Low-Side Switch with SPI and Parallel Input Control(帶SPI和并口輸入控制的6輸出低端開關(guān))
中文描述: 六輸出低壓側(cè)開關(guān)SPI和并行輸入控制(帶的SPI和并口輸入控制的6輸出低端開關(guān))
文件頁數(shù): 8/24頁
文件大小: 779K
代理商: MC33882
33882
8
Go to: www.freescale.com
THERMAL RESISTANCE
(Note 9), (Note 10)
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s) (Note 11)
HSOP
QFN
R
θ
JA
41
85
°
C/W
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p) (Note 12)
HSOP
QFN
R
θ
JMA
18
27
°
C/W
Junction-to-Board (Bottom)
HSOP
QFN
R
θ
JB
3.0
10
°
C/W
Junction-to-Case (Top) (Note 13)
HSOP
QFN
R
θ
JC
0.2
1.2
°
C/W
Notes
9.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC 883,
Method 1012.1) with the cold plate temperature used for the case temperature.
10.
11.
12.
13.
MAXIMUM RATINGS
(continued)
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Limit
F
Freescale Semiconductor, Inc.
For More Information On This Product,
n
.
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