參數(shù)資料
型號: MAX1964TEEE
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類: 穩(wěn)壓器
英文描述: Tracking/Sequencing Triple/Quintuple Power-Supply Controllers
中文描述: 0.05 A SWITCHING CONTROLLER, 240 kHz SWITCHING FREQ-MAX, PDSO16
封裝: 0.150 INCH, 0.025 INCH PITCH, QSOP-16
文件頁數(shù): 18/30頁
文件大?。?/td> 475K
代理商: MAX1964TEEE
M
current-sense range. For a good compromise between
efficiency and cost, choose a high-side MOSFET (N
H
)
that has conduction losses equal to the switching loss-
es at the optimum input voltage. Check to ensure that
the conduction losses at minimum input voltage don
t
exceed the package thermal limits or violate the overall
thermal budget. Check to ensure that the conduction
losses plus switching losses at the maximum input volt-
age don
t exceed package ratings or violate the overall
thermal budget.
The low-side MOSFET (N
L
) provides the current-limit
signal, so choose a MOSFET with an R
DS(ON)
large
enough to provide adequate circuit protection (see the
Setting the Current-Limit
section):
Use the worst-case maximum value for R
DS(ON)
from
the MOSFET NL data sheet, and add some margin for
the rise in R
DS(ON)
over temperature. A good general
rule is to allow 0.5% additional resistance for each
°
C of
the MOSFET junction temperature rise. Ensure that the
MAX1964/MAX1965 DL gate drivers can drive N
L
; in
other words, check that the dv/dt caused by N
H
turning
on does not pull up the N
L
gate due to drain-to-gate
capacitance, causing cross-conduction problems.
MOSFET package power dissipation often becomes a
dominant design factor. I
2
R power losses are the great-
est heat contributor for both high-side and low-side
MOSFETs. I
2
R losses are distributed between N
H
and
N
L
according to duty factor as shown in the equations
below. Generally, switching losses affect only the high-
side MOSFET, since the low-side MOSFET is a zero-
voltage switched device when used in the buck
topology.
Gate-charge losses are dissipated by the driver and do
not heat the MOSFET. Calculate the temperature rise
according to package thermal-resistance specifications
to ensure that both MOSFETs are within their maximum
junction temperature at high ambient temperature. The
worst-case dissipation for the high-side MOSFET (P
NH
)
occurs at both extremes of input voltage, and the worst-
case dissipation for the low-side MOSFET (P
NL
) occurs
at maximum input voltage.
I
GATE
is the average DH driver output current capability
determined by:
where R
DS(ON)DH
is the high-side MOSFET driver
s on-
resistance (4
max), and R
GATE
is any resistance
placed between DH and the high-side MOSFET
s gate
(Figure 5).
To reduce EMI caused by switching noise, add a 0.1μF
ceramic capacitor from the high-side switch drain to the
low-side switch source or add resistors (max 47
) in
series with DL and DH to increase the switches
turn-on
and turn-off times (Figure 5).
The minimum load current should exceed the high-side
MOSFET
s maximum leakage current over temperature
if fault conditions are expected.
Input Capacitor
The input filter capacitor reduces peak currents drawn
from the power source and reduces noise and voltage
ripple on the input caused by the circuit
s switching.
The input capacitor must meet the ripple current
requirement (I
RMS
) imposed by the switching currents
defined by the following equation:
P
I
R
V
V
P
P
P
P
I
R
V
V
NH CONDUCTION
(
LOAD
DS ON NH
(
OUT
IN
NH TOTAL
(
NH SWITCHING
(
NH CONDUCTION
(
NL
LOAD
DS ON NL
(
OUT
IN
)
)
)
)
)
)
=
=
+
=
2
2
1-
I
VL
R
(
R
GATE
DS ON DH
(
GATE
=
+
)
2
)
P
V I
Q
Q
I
NH SWITCHING
(
GS
GD
GATE
)
=
+
R
V
I
DS ON
(
VALLEY
VALLEY
)
=
Tracking/Sequencing Triple/Quintuple
Power-Supply Controllers
18
______________________________________________________________________________________
Figure 5. Reducing the Switching EMI
BST
N
H
R
GATE
(OPTIONAL)
N
L
R
GATE
(OPTIONAL)
C
BST
DH
LX
L
TO VL
DH
GND
MAX1964
MAX1965
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