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參數(shù)資料
| 型號： | M58CR064C10ZB6T |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | 64 Mbit 4Mb x 16, Dual Bank, Burst 1.8V Supply Flash Memory |
| 中文描述： | 64兆位4Mb的× 16，雙行，突發(fā)1.8V電源快閃記憶體 |
| 文件頁數(shù)： | 26/70頁 |
| 文件大小： | 1000K |
| 代理商： | M58CR064C10ZB6T |
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M58CR064C, M58CR064D, M58CR064P, M58CR064Q
26/70
READ MODES
Read operations can be performed in two different
ways depending on the settings in the Configura-
tion Register.
If the clock signal is ‘don’t care’ for
the data output, the read operation is Asynchro-
nous; if the data output is synchronized with clock,
the read operation is Synchronous.
The Read mode and data output format are deter-
mined by the Configuration Register. (See Config-
uration Register section for details). All banks
supports both asynchronous and synchronous
read operations. The Dual Bank architecture al-
lows read operations in one bank, while write op-
erations are being executed in the other (see
Tables 11 and 12).
Asynchronous Read Mode
In Asynchronous Read operations the clock signal
is ‘don’t care’. The device outputs the data corre-
sponding to the address latched, that is the mem-
ory array, Status Register, Common Flash
Interface or Electronic Signature depending on the
command issued. CR15 in the Configuration Reg-
ister must be set to ‘1’ for Asynchronous opera-
tions.
In Asynchronous Read mode a Page of data is in-
ternally read and stored in a Page Buffer. The
Page has a size of 4 Words and is addressed by
A0 and A1 address inputs. The address inputs A0
and A1 are not gated by Latch Enable in Asyn-
chronous Read mode.
The first read operation within the Page has a
longer access time (T
acc
, Random access time),
subsequent reads within the same Page have
much shorter access times. If the Page changes
then the normal, longer timings apply again.
Asynchronous Read operations can be performed
in two different ways, Asynchronous Random Ac-
cess Read and Asynchronous Page Read. Only
Asynchronous Page Read takes full advantage of
the internal page storage so different timings are
applied.
See Table 20, Asynchronous Read AC Character-
istics, Figure 10, Asynchronous Random Access
Read AC Waveform and Figure 11, Asynchronous
Page Read AC Waveform for details.
Synchronous Burst Read Mode
In Synchronous Burst Read mode the data is out-
put in bursts synchronized with the clock. It is pos-
sible to perform burst reads across bank
boundaries.
Synchronous Burst Read mode can only be used
to read the memory array. For other read opera-
tions, such as Read Status Register, Read CFI
and Read Electronic Signature, Single Synchro-
nous Read or Asynchronous Random Access
Read must be used.
In Synchronous Burst Read mode the flow of the
data output depends on parameters that are con-
figured in the Configuration Register.
A burst sequence is started at the first clock edge
(rising or falling depending on Valid Clock Edge bit
CR6 in the Configuration Register) after the falling
edge of Latch Enable or Chip Enable, whichever
occurs last. Addresses are internally incremented
and after a delay of 2 to 5 clock cycles (X latency
bits CR13-CR11) the corresponding data are out-
put on each clock cycle.
The number of Words to be output during a Syn-
chronous Burst Read operation can be configured
as 4 or 8 Words or Continuous (Burst Length bits
CR2-CR0). The data can be configured to remain
valid for one or two clock cycles (Data Output Con-
figuration bit CR9).
The order of the data output can be modified
through the Burst Type and the Wrap Burst bits in
the Configuration Register. The burst sequence
may be configured to be sequential or interleaved
(CR7). The burst reads can be confined inside the
4 or 8 Word boundary (Wrap) or overcome the
boundary (No Wrap). If the starting address is
aligned to the Burst Length (4 or 8 Words), the
wrapped configuration has no impact on the output
sequence. Interleaved mode is not allowed in Con-
tinuous Burst Read mode or with No Wrap se-
quences.
A WAIT signal may be asserted to indicate to the
system that an output delay will occur. This delay
will depend on the starting address of the burst se-
quence; the worst case delay will occur when the
sequence is crossing a 64 word boundary and the
starting address was at the end of a four word
boundary.
WAIT is asserted during the Wait state and at the
end of 4- and 8-Word Burst. It is deasserted during
the X latency and when output data are valid. In
Continuous Burst Read mode a Wait state will oc-
cur when crossing the first 64 Word boundary. If
the burst starting address is aligned to a 4 Word
Page, the Wait state will not occur.
The WAIT signal is active Low. The WAIT signal is
meaningful only in Synchronous Burst Read
mode, in other modes, WAIT is not asserted (ex-
cept for Read Array mode).
See Table 21, Synchronous Read AC Character-
istics and Figure 12, Synchronous Burst Read AC
Waveform for details.
Single Synchronous Read Mode
Single Synchronous Read operations are similar
to Synchronous Burst Read operations except that
only the first data output after the X latency is valid.
Other Configuration Register parameters have no
effect on Single Synchronous Read operations.
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相關(guān)代理商/技術(shù)參數(shù) |
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| M58CR064C12ZB6T | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:64 Mbit 4Mb x 16, Dual Bank, Burst 1.8V Supply Flash Memory |
| M58CR064C85ZB6T | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:64 Mbit 4Mb x 16, Dual Bank, Burst 1.8V Supply Flash Memory |
| M58CR064C90ZB6T | 功能描述:閃存 64M (4Mx16) 90ns RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結(jié)構(gòu):256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| M58CR064CZB | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:64 Mbit 4Mb x 16, Dual Bank, Burst 1.8V Supply Flash Memory |
| M58CR064D | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:64 Mbit 4Mb x 16, Dual Bank, Burst 1.8V Supply Flash Memory |
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