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參數(shù)資料
| 型號： | LTC2225CUH#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 7/20頁 |
| 文件大小： | 0K |
| 描述： | IC ADC 12BIT 10MSPS 3V 32-QFN |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 位數(shù)： | 12 |
| 采樣率（每秒）： | 10M |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 功率耗散（最大）： | 69mW |
| 電壓電源： | 單電源 |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-WFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 32-QFN 裸露焊盤（5x5） |
| 包裝： | 帶卷 (TR) |
| 輸入數(shù)目和類型： | 1 個單端，雙極; 1 個差分，雙極 |
LTC2225
15
2225fa
APPLICATIO S I FOR ATIO
WU
UU
and nap modes, all digital outputs are disabled and enter
the Hi-Z state.
Grounding and Bypassing
The LTC2225 requires a printed circuit board with a clean,
unbroken ground plane. A multilayer board with an inter-
nal ground plane is recommended. Layout for the printed
circuit board should ensure that digital and analog signal
lines are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, REFH, and REFL pins. Bypass capaci-
tors must be located as close to the pins as possible. Of
particular importance is the 0.1
F capacitor between
REFH and REFL. This capacitor should be placed as close
to the device as possible (1.5mm or less). A size 0402
ceramic capacitor is recommended. The large 2.2
F
capacitor between REFH and REFL can be somewhat
further away. The traces connecting the pins and bypass
capacitors must be kept short and should be made as wide
as possible.
The LTC2225 differential inputs should run parallel and
close to each other. The input traces should be as short as
possible to minimize capacitance and to minimize noise
pickup.
Heat Transfer
Most of the heat generated by the LTC2225 is transferred
from the die through the bottom-side exposed pad and
package leads onto the printed circuit board. For good
electrical and thermal performance, the exposed pad
should be soldered to a large grounded pad on the PC
board. It is critical that all ground pins are connected to a
ground plane of sufficient area.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LTC2225IUH | 制造商:Linear Technology 功能描述:ADC Single Pipelined 10Msps 12-bit Parallel 32-Pin QFN EP |
| LTC2225IUH#PBF | 功能描述:IC ADC 12-BIT 10MSPS 3V 32-QFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:microPOWER™ 位數(shù):8 采樣率（每秒）:1M 數(shù)據(jù)接口:串行，SPI? 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:- 電壓電源:模擬和數(shù)字 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-VQFN 裸露焊盤（4x4） 包裝:Digi-Reel® 輸入數(shù)目和類型:8 個單端，單極 產(chǎn)品目錄頁面:892 (CN2011-ZH PDF) 其它名稱:296-25851-6 |
| LTC2225IUH#TR | 制造商:Linear Technology 功能描述:ADC Single Pipelined 10Msps 12-bit Parallel 32-Pin QFN EP T/R |
| LTC2225IUH#TRPBF | 功能描述:IC ADC 12BIT 10MSPS 3V 32-QFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 位數(shù):16 采樣率（每秒）:45k 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:2 功率耗散（最大）:315mW 電壓電源:模擬和數(shù)字 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC W 包裝:帶卷 (TR) 輸入數(shù)目和類型:2 個單端，單極 |
| LTC2226 | 制造商:LINER 制造商全稱:Linear Technology 功能描述:14-Bit, 125/105Msps Low Power 3V ADCs |
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